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SEMI E106-1104 © SEMI 2000, 2004 1 SEMI E106-1104 OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSI CAL INTERFACES AND CARRI ERS FOR 300 mm WAFERS This guide was technically appro ved by the Global Ph y s ical Inter faces &…
SEMI E104-0303 © SEMI 2000, 2003 18
APPENDIX 4
AEROSOL TRANSPORT AND AEROSOL SAMPLING
NOTICE: The material in this appendix is an official part of SEMI E104 and was approved by full letter ballot
procedures on July 28, 2000 by the European Regional Standards Committee.
A4-1 Aerosol Transport
A4-1.1 Aerosol loss in lines occurs both for small and
larger particles. Larger particles (approximately 5 µm
and larger) are lost as a result of gravitational settling in
horizontal lines and inertial effects in all lines. Smaller
particles are lost to the line walls by diffusion and by
electrostatic charge effects.
A4-1.2 A limitation of particle loss could be achieved
with tubing as short and as straight as possible with no
bends with a radius of curvature less than 100 mm. The
tubing of the calibration setup should be smooth,
conductive, and electrically grounded. Stainless,
polished steel for rigid lines and Polyurethane or
polyvinyl chloride for flexible lines is found acceptable
for handling most aerosols with low electrostatic
particle loss. If long transit lines are required, they
should be sized to permit a Reynolds number in the
range of 5,000 to 25,000 at the sample flow rate to
minimize particle residence time in the tubing without
causing excessive turbulence at high flow rates.
A4-2 Aerosol Sample Acquisition
A4-2.1 The term isokinetic sampling often is used in
aerosol measurement and characterization. Isokinetic
sampling of particles in a moving aerosol is performed
by matching the sample probe inlet velocity (flow speed
and
direction) to the velocity of the moving aerosol. At
velocities less than 15 m/s, anisokinetic sampling errors
are negligible for most particles smaller than
approximately 5 µm. Losses of larger particles might be
significant. The larger the particle, the larger the loss
due to inertial effects. Isokinetic sampling is not
possible in environmental conditions with varying
velocity, motionless air, and turbulent, random, or non-
unidirectional flow. For better sampling inlet efficiency,
isokinetic or at least isoaxial sampling is recommended
at calibration.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer' s instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publications of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E106-1104 © SEMI 2000, 2004 1
SEMI E106-1104
OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSICAL
INTERFACES AND CARRIERS FOR 300 mm WAFERS
This guide was technically approved by the Global Physical Interfaces & Carriers Committee and is the direct
responsibility of the North American Physical Interfaces & Carriers Committee. Current edition approved by
the North American Regional Standards Committee on July 11, 2004 and August 16, 2004. Initially
available at www.semi.org September 2004; to be published November 2004. Originally published October
2000; previously published March 2003. This document replaces SEMI PR6-0200 in its entirety.
1 Purpose
1.1 This document is intended to help users and
suppliers of 300 mm carriers and production equipment
to understand the complex interdependencies among the
SEMI standards for 300 mm physical interfaces and
carriers and to determine which standards apply to
which products. As shown in Figure 1, these standards
are highly inter-related, have many complex
dependencies, and inherit a numbering system (from
legacy 200 mm standards) that is non-intuitive.
2 Scope
2.1 This document describes how the SEMI standards
for 300 mm physical interfaces and carriers work
together. This document also clarifies the requirements
(direct and indirect) on suppliers of each product, and
suggests how users see these standards and options.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
M1.15, M8, M28
Wafer
E25
Cluster - Tool
Module Access
E26.1
Radial Cluster -
Tool Footprint
E21.1
Cluster
-
Tool
Module Interface
G77
Frame Cassette
E22.1
Cluster - Tool
End
Effector
M31
FOSB
G74
Tape Frame
E103
SWIF
E47.1
FOUP
E62
FIMS
E15.1
Load
Port
E63
BOLTS-M
E92
Bolts
-
Light
E83
PGV Docking
Flange
E64
Cart
Docking
Interface
E72
Equipment
Footprint, Height,
and Weight
E1.9
Cassette
E85
AMHS
Interoperabiity
E84
Carrier
Handoff
Parallel I/O
E57
Kinematic
Coupling
E110
Indicator/
switch
Placement
M1.15, M8, M28
Wafer
E25
Cluster - Tool
Module Access
E26.1
Radial Cluster -
Tool Footprint
E21.1
Cluster
-
Tool
Module Interface
G77
Frame Cassette
E22.1
Cluster - Tool
End
Effector
M31
FOSB
G74
Tape Frame
E103
SWIF
E47.1
E62
FIMS
E15.1
Load
Port
E92
Bolts
-
Light
E83
PGV Docking
Flange
E64
Cart
Docking
Interface
E72
Equipment
Footprint, Height,
and Weight
E1.9
Cassette
E85
AMHS
Interoperabiity
E84
Carrier
Handoff
Parallel I/O
E57
Kinematic
Coupling
E110
Indicator/
switch
Placement
Figure 1
Complex Relationships and Dependencies Among 300 mm Standards
SEMI E106-1104 © SEMI 2000, 2004 2
3 Limitations
3.1 300 mm Only — This document only covers SEMI
standards that are specific to 300 mm, even though
other standards may apply to 300 mm equipment. For
example, standards not described here include:
metrics documents such as SEMI E10;
minienvironment documents such as SEMI E45
and and SEMI E46;
facilities documents such as SEMI E70;
reticle handling documents such as SEMI E100
which specifies a reticle SMIF pod for 6-inch or
230 mm reticles based on SEMI E19.4; or
safety documents such as SEMI S2, SEMI S8,
SEMI S11 and an upcoming Safety Guideline for
Unmanned Transport Vehicle (UTV) Systems.
3.2 Physical Interfaces and Carriers Only — This
document also does not cover standards that were
generated by committees other than the SEMI Physical
Interfaces and Carriers Committee, even though such
standards may be specific to 300 mm. For example,
standards not described here include:
Information and Control documents such as SEMI
E82; and
Silicon documents such as SEMI M1.15, SEMI
M8, and SEMI M28 (Developmental Wafers).
4 Referenced Standards
4.1 SEMI Standards
SEMI E1.9 — Mechanical Specification for Cassettes
Used to Transport and Store 300 mm Wafers
SEMI E10 — Specification for Definition and
Measurement of Equipment Reliability, Availability,
and Maintainability (RAM)
SEMI E15 — Specification for Tool Load Port
SEMI E15.1 — Specification for 300 mm Tool Load
Port
SEMI E19 — Standard Mechanical Interface (SMIF)
SEMI E19.4 — 200 mm Standard Mechanical Interface
(SMIF)
SEMI E21.1 — Cluster Tool Module Interface 300
mm: Mechanical Interface and Wafer Transport
Standard
SEMI E22.1 — Cluster Tool Module Interface 300
mm: Transport Module End Effector Exclusion Volume
Standard
SEMI E23 — Specification for Cassette Transfer
Parallel I/O Interface
SEMI E25 — Cluster Tool Module Interface: Module
Access Guideline
SEMI E26.1 — Radial Cluster Tool Footprint 300 mm
Standard
SEMI E45 — Test Method for the Determination of
Inorganic Contamination from Minienvironments Using
Vapor Phase Decomposition-Total Reflection X-Ray
Spectroscopy (VPD-TXRF), VPD-Atomic Absorption
Spectroscopy (VPD-AAS), or VPD/Inductively
Coupled Plasma-Mass Spectrometry (VPD/ICP-MS)
SEMI E46 — Test Method for the Determination of
Organic Contamination from Minienvironments Using
Ion Mobility Spectrometry (IMS)
SEMI E47.1 — Provisional Mechanical Specification
for Boxes and Pods Used to Transport and Store 300
mm Wafers
SEMI E57 — Mechanical Specification for Kinematic
Couplings Used to Align and Support 300 mm Wafer
Carriers
SEMI E62 — Provisional Specification for 300 mm
Front-Opening Interface Mechanical Standard (FIMS)
SEMI E63 — Mechanical Specification for 300 mm
Box Opener/Loader to Tool Standard (BOLTS-M)
Interface
SEMI E64 — Specification for 300 mm Cart to SEMI
E15.1 Docking Interface Port
SEMI E70 — Guide for Tool Accommodation Process
SEMI E72 — Specification and Guide for 300 mm
Equipment Footprint, Height, and Weight
SEMI E82 — Specification for Interbay/Intrabay
AMHS SEM (IBSEM)
SEMI E83 — Specification for 300 mm PGV
Mechanical Docking Flange
SEMI E84 — Specification for Enhanced Carrier
Handoff Parallel I/O Interface
SEMI E85 — Specification for Physical AMHS
Stocker to Interbay Transport System Interoperability
SEMI E92 — Specification for 300 mm Light Weight
and Compact Box Opener/Loader to Tool-
Interoperability Standard (BOLTS/Light))
SEMI E99 — The Carrier ID Reader/Writer Functional
Standard: Specification of Concepts, Behavior, and
Services