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SEMI T13-1104 © SEMI 2004 8 DieT raceDat a show Property show Data ID Ty p e Ci r c ui t Mod ul e Dat aReference Dat aV al ue Figure 4 Die Trace Data Class 9.4.1.3. 1 showProperty — This service returns all or a part of …

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SEMI T13-1104 © SEMI 2004 7
9.2 UML representation — The diagram above is
modeling of Tracing Capability for Dice in UML
diagram. It is not required to make systems with object
oriented programming language compliant to this
specification. Even if UML is typical object oriented
representation, object oriented implementation may be
expected but may not be mandatory.
9.3 Ensemble Modeling — Die tracing can be done at
any stage of process. Collected data on such different
processes for a specific die are linked together and
accumulated as a serialized one Die Trace Data.
Because the serialized data is an ensemble of snapshot
data of each key process stage. This document models
such snapshot of the ensemble as depicted above Figure
1.
9.3.1 Die Trace Machine Object (Machine) — This is
an instance of Die Trace Machine class (Machine). The
Machine acquires Die Trace Data and reports the data
to associated Tracer.
9.3.1.1 Special Machines — However Die Trace
Machines are often physical equipment, they may be
sometimes such non-automated entities as human
assisted semi-automated manufacturing tools and
handcraft processes. Die Trace Machine is any entity to
process products or make metrology assistance and
have capability to report Due Trace Data on the shop
flower of semiconductor device manufacturing. They
need to manufacture exactly and input at the terminal
by the process or record on work schedule pad for later
input in the office.
9.3.2 Die Tracer Object (Tracer) — This is an instance
of Die Trace class (Tracer). The Tracer collects Die
Trace Data reported by Die Trace Machine below. The
Tracer searches Die Trace Data as requested by Die
Trace Client. Figure 3 is a class model of a cell which
consists of a Tracer and its reporting Machines.
9.3.2.1 Data Searching Chain — Because the Tracer
inherits Client class, the Tracer can ask the other Tracer
when it doesn’t have enough data to respond a request.
Because the Tracer knows very specific type of Tracer,
the inquiring chain is usually restarted at the specific
Tracer.
9.3.2.2 Data Source of Tracer — There are different
kinds of data source from the Machine. Sometimes such
entities as controlling computers, database systems and
their software processes or application programs could
be data source of Die Tracer. The controlling computers
may be called as Manufacturing Execution System
(MES), Work In Process (WIP) computer, Host
computer, Cell Controller and so on.
9.3.3 Die Trace Client Object (Client) — This is an
instance of Die Trace Client class (Client). Basically
the Client asks some Die Trace Data set, asks searching
Die Trace Data or sets expecting data items to be
collected next. At the same time some specific Client
may be asked to register concerning phenomena happen
on specific product or specific production group, or
notify serious problem potentially happens on specific
product or production group to possible customers or
quality assurance database computer of semiconductor
device manufacturer.
9.4 Die Trace Data Hierarchy and Linkage — As
described very briefly in Section 8.7 Data Taxonomy,
whole substrate trace data may complement die trace
data on the substrate. They should be linked by some
means to keep the relation. Possible data hierarchy is as
below.
9.4.1 Die Trace Data (DTD)— This is a generic class
of any kind of Die Trace Data. This class represents
basic concept and primitive nature of data acquired for
Die Tracing. Any objects instanced for this class or its
derived class have following responsibility.
9.4.1.1 Die Trace Data Class Definition — Die Trace
Data must have such attribute as ID, Type and etc. as
depicted on Figure 4. These attributes cannot be
changed because they are proper for a specific object.
Because this document doesn’t intend these attributes to
be accessed directly but just for reference to specify
services to access or make use of these attributes. This
class is used to discuss and handle generic issues of any
subclasses.
9.4.1.1.1 Target Material — Die Trace Data need to
specify intended material. Die Trace Data must have an
attribute for the purpose and it shall provide a service to
identify the target material.
9.4.1.1.2 Data Representation — Actual Data may be
contained in its object as an attribute if amount of data
is relatively small. However it may be stored in such
independent entity as files or database and referenced
with an attribute of this class if the data is relatively
large and the attribute for data value must be null. This
case it is suggested to take care of the separated data
value not to be removed. Storage system often may not
notify or ask when related data is removed. It may be
better to have another copy of the important data
somewhere in Die Tracing System. It is recommended
to use any Universal Resource Identifier (URI) for data
value reference to access without confusion.
9.4.1.2 Responsibility of Die Trace Data — Because
Die Trace Data class is to be data container or data
label, responsibility of this class is to play the role.
9.4.1.3 Services of Die Trace Data — To complete the
responsibility, this class provides following services.
SEMI T13-1104 © SEMI 2004 8
DieTraceData
showProperty
showData
ID
Type
CircuitModule
DataReference
DataValue
Figure 4
Die Trace Data Class
9.4.1.3.1 showProperty — This service returns all or a part of attributes of this object except actual Die Trace Data
value.
9.4.1.3.2 showData — This service returns actual Die Trace Data value regardless whether it is contained in this
object or separated entity.
9.4.1.4 Behavior of Die Trace Data — Behavior is defined to complete responsibility of the Die Trace Data. The
behavior is often specified through collaboration with outside of this class and state model. Because this class has
services to access internal attributes including referenced data value, it defines no collaboration. Also this class
defines no state model for it is stateless.
Die-trace Map
Data (DMD)
Die-trace Die
Data (DDD)
Die-trace Substrate
Data (DSD)
Die-trace Lot
Data (DLD)
Die-trace Batch
Data (DBD)
1..*
Die
Die Trace Data
(DTD)
com
p
lements
com
p
lements
com
p
lements
com
p
lements
charac terized
Substrate
charac terized
Lot
characterized
Batch
characterized
1
..* 1..*
1
..*
0
..* 0..* 0..1 0..1
Figure 5
Die Trace Data Hierarchy, Associations and Linkages
SEMI T13-1104 © SEMI 2004 9
Substrate
Die
0..*
Batch Lot
0..*
OR
1..* 1..*
1..*
Figure 6
Lot vs. Batch
9.4.2 Die-trace Die Data (DDD) — This is Die Trace
Data for a die on a certain process. Examples of the
data are electric test classification information often
referred to as BIN code and wire bonding inspection
data for a die.
9.4.3 Die-trace Map Data (DMD) — Die-trace Die
Data are often grouped together on the process which is
executed on a mother substrate. The grouped data is
referred to as a map and is usually two-dimensional
array or matrix. Examples are probing test data and die
ID map of mounting/inserting data on PCB or lead
frame strip.
9.4.4 Die-trace Substrate Data (DSD) — This Die
Trace Data is specific for a substrate on a certain
process. Examples of the substrate are wafer, glass plate
for flat panel display, such strip as PCB and so on. This
data has no special distribution on the substrate or may
have some distribution but may not be a Die-trace Map
Data. Sometimes this data has very strong correlation
with most Die-trace Die Data on the substrate when, for
example, this data shows remarkable deviation from
normal process result. So the Die-trace Die Data need
to keep linkage with this data for complement.
9.4.5 Die-trace Lot Data (DLD) — This Die Trace
Data is specific for a lot on a certain process. Lot is a
group of material or products for the sake of expedient
to produce a specific product. A unit of a lot may be
different on each process or product. The lot here
doesn’t include group just for delivery. Because of
similar linkage as Die-trace Substrate Data, the data
need to keep linkage with this data for complement.
9.4.6 Die-trace Batch Data (DBD) — This Die Trace
Data is specific for a batch on a certain process. Batch
is a group of material or products for the sake of
expedient to execute a process. A unit of a batch may
be different on each process or equipment. Because of
similar linkage as Die-trace Substrate Data, the data
need to keep linkage with this data for complement.
9.4.7 Lot versus Batch — Because lot and batch are
both a group of material or products, their unit sizes are
alternative. However sometimes the unit of a lot may be
smaller than that of a batch on a process, the relation
may be opposite on the other process for the same
product, as illustrated on Figure 6. Lot is more related
to production plan, production strategy or sprit/merge
operation. While, batch is close to process or equipment
type, configuration and structure.
9.5 Physical Substrate Model — Because die tracing
may need to be started from very early manufacturing
process and completed at the such final product as cell
phone and Television set, there are many different types
of substrates appears as objects of tracing: e.g. wafer,
die and PCB. While their appearances are fairly
different, some characteristics are common. It is
convenient to separate the common nature as a base
class object, as illustrated on Figure 7. Also the class
diagram shows which will be physical tracing target
and helps understanding which target make which Die
Trace Data. This diagram gives just taxonomy of die
trace target substrate in a sense.
9.5.1 Circuit Module — This class represents any
modular electric circuit and is the common part of any
substrate appears as an object of die tracing. Each
Circuit Module in die tracing world has corresponding
Die Trace Data. The Die Trace Data may link to the
other subtype of Die Trace Data: e.g. as aggregation or
complement. Circuit Module may have smaller grain
Circuit Modules on it as components. For example,
such a strip as PCB or linked lead frames has dice. This
class has subclasses: Die and Mother Substrate.