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SEMI T14.1-0705 © SEMI 2005 1 SEMI T14.1-0705 SPECIFICATION FOR THE MICR O ID OF SHORT VERTICAL DIMENSION ON 300 mm WAFERS This specification was technic a lly approved b y the global Trace ability Committee . This editi…

SEMI T14-1104 © SEMI 2004 8

RELATED INFORMATION 2

APPLICATION NOTES

NOTICE: This related information is not an official part of SEMI (doc#) and was derived from the Japanese

Traceability Committee. This related information was approved for publication by full letter ballot on July 23,

2004.

R2-1 References

R2-1.1 The following papers may be referred to understand Micro ID technology presented in this document.

1) Improvement in Reading Precision of Micro-ID Engraved on Wafer, ISSM2003, 2003/09/30

2) Micro-ID Technology for Single Wafer Management, ISSM2002, 2002/10/17

3) New Identification System for Individual Wafer Management, ISSM2000; Session II-6 (2000) Page 33,

2000/9/26

R2-2 SEMI Activities

R2-2.1 Additional information is gathered at 2

round robin of the Micro ID Task Force. Many of such

information turned out to be excellent and valuable in reading the Micro ID.

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant

literature, respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted

material or of an invention covered by patent rights. Komatsu Ltd. and Toshiba Corp. have filed a statement with

SEMI asserting that licenses will be made available to applicants throughout the world for the purpose of

implementing this standard without unfair discrimination. Attention is also drawn to the possibility that some

elements of this standard may be subject to patented technology or copyrighted items other than those identified

above. Semiconductor Equipment and Materials International (SEMI) shall not be held responsible for identifying

any or all such patented technology or copyrighted items. By publication of this standard, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights and

the risk of infringement of such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI T14.1-0705 © SEMI 2005 1

SEMI T14.1-0705

SPECIFICATION FOR THE MICRO ID OF SHORT VERTICAL

DIMENSION ON 300 mm WAFERS

This specification was technically approved by the global Traceability Committee. This edition was

approved for publication by the global Audits and Reviews Subcommittee on May 20, 2005. It was available

at www.semi.org in June 2005 and on CD-ROM in July 2005.

1 Purpose

1.1 The purpose of this document is to specify a new means of identification with the Micro ID on 300 mm

polished monocrystalline Silicon wafer with polished edge for process control.

1.2 The objective of the Micro ID is to keep unique information to be assigned in the device manufacturing process

on the location defined on the wafer bevel.

1.3 This sub-document to SEMI T14 is intoned that Micro ID technology should be enhanced further to apply on

more precipitous edge profile 300 mm polished wafers.

2 Scope

2.1 This document assumes that the Micro ID is implemented under the responsibility of Device Manufacturers.

2.2 A two-dimensional data matrix code symbol consists of the microdots marked on the bevel of a semiconductor

wafer.

2.3 Although this specification does not specify the marking techniques that may be employed when complying

with its requirements, it is assumed that the microdots will be obtained by laser irradiated individual dots.

2.4 The data matrix code symbol is applicable to a broad range of wafer products (un-patterned or patterned wafers)

with mirror polished

bevel surface.

2.5 The format and algorithms of this code are based on two-dimensional symbology specified in ISO

/IEC

ISS

16022.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish appropriate safety health practices and determine the

applicability or regulatory limitations prior to use.

3 Referenced Standards and Documents

3.1 SEMI Standards

SEMI M1 — Specifications of Polished Monocrystalline Silicon Wafers

SEMI T14 — Specification for Micro ID on 300mm Silicon Wafers

3.2 ISO/IEC Standard

ISO/IEC ISS 16022 — International Symbology Specification – Data Matrix

NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

4 Terminology

4.1 Definitions

4.1.1 binary values — a protrusion dot in the wafer surface indicates the binary value 1. The absence of a dot or a

smooth surface surrounding a cell center point indicates the binary value 0.

1 International Organization for Standardization, ISO Central Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland.

Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30 Website: http://www.iso.ch

2 International Electrotechnical Commission, 3, rue de Varembé, Case Postale 131, CH-1211 Geneva 20, Switzerland. Telephone:

41.22.919.02.11; Fax: 41.22.919.03.00 Website: http://www.iec.ch

SEMI T14.1-0705 © SEMI 2005 2

4.1.2 border column — the outermost column of a data matrix code symbol. This column is a portion of the finder

pattern.

4.1.3 border row — the outermost row of a data matrix code symbol. This row is a portion of the finder pattern.

4.1.4 cell center point, of an array — the point at which the centerline of a row intersects the centerline of a

column.

4.1.5 cell, of a data matrix code symbol — the area within which a dot may be placed to indicate a binary value.

4.1.6 cell spacing, of an array — the (equal) vertical or horizontal distance between the cell center points of

contiguous cells.

4.1.7 center line, of a row or column — the line positioned parallel to, and spaced equally between, the boundary

lines of the row or column.

4.1.8 central area, of a cell — the area enclosed by a circle centered at the cell center point; used by code readers to

sense the binary value of the cell.

4.1.9 data matrix code symbol — a two-dimensional array of square cells arranged in contiguous rows and

columns. In certain ECC200 symbols, data regions are separated by alignment patterns. The data region is

surrounded by a finder pattern [ISO/IEC ISS 16022].

4.1.10 finder pattern, of a data matrix code symbol — a perimeter to the data region. Two adjacent sides contain

dots in every cell; these are used primarily to define physical size, orientation and symbol distortion. The two

opposite sides are made up of cells containing dots in alternate cells [ISO/IEC ISS 16022].

4.1.11 Micro ID — Micro ID consists of the data matrix code symbol, which is formed with some protruding marks

on the silicon wafers.

4.1.12 protrusion dot — a locally protruded region with a reflectance which differs from that of the surrounding

surface.

4.1.13 NOTE 1: To assure reading efficiency, a minimum contrast of 30% is required between the reflectance value of a dot and

the surrounding wafer surface. Various densitometers can provide such measurements nondestructively.

4.1.14 protrusion dot misalignment, within a cell — the distance between the physical center point of a protrusion

dot and the cell center point.

5 Requirements

5.1 Shape and Size of the Data Matrix Code Symbol

5.1.1 Each rectangle data matrix code symbol shall be composed of an array of 12 rows and 26 columns as defined

in ISO/IEC ISS 16022, as shown in Figure 1.

5.1.2 Cell spacing shall be 4.17µm, center to center, as shown in Figure 2.

5.2 Shape and Size of the Microdot Mark

5.2.1 A microdot mark is formed by laser irradiation and consists of a single dot mark on each laser-irradiated

point.

5.2.2 The mark has a single protrusion, which includes a concave portion provided around the protrusion and lower

than a surface of the wafer and whose center portion protrudes upward so as to be higher than the surface of the

wafer.

5.2.3 The nominal shape of the dot produced in the matrix may be circular or square. It’s diameter or edge length

shall be 4.0 µm + 10% – 20%, Figure 3 shows one of the examples.

5.3 Border Rows and Columns

5.3.1 One border row and one border column shall contain a dot in each cell. These are identified as the primary

border row and the primary border column. They are used by the code reader to determine the orientation of the

matrix.

5.3.2 The opposing (secondary) border row and column shall contain dots in alternating cells.