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SEMI T14.1-0705 © SEMI 2005 8 RELATED INFORMATION 2 APPLICATION NOTES NOTICE : This relat ed information is not an offici al part of SEMI T14.1 an d was derived from full lett er ballot procedures on May 20, 2005. R1-2 R…

SEMI T14.1-0705 © SEMI 2005 7

Back Grinded area

Polished Area by

Chemical Mechanical Polishing (CMP)

Remaining area for Micro ID

Back Grinded area

Polished Area by

Chemical Mechanical Polishing (CMP)

Remaining area for Micro ID

NOTE: Figure R1-2 is not to scale.

Figure R1-2 (Side view)

Data Matrix Code Location on Front Bevel Surface of 300 mm Diameter Wafer

SEMI T14.1-0705 © SEMI 2005 8

RELATED INFORMATION 2

APPLICATION NOTES

NOTICE: This related information is not an official part of SEMI T14.1 and was derived from full letter ballot

procedures on May 20, 2005.

R1-2 References

R1-2.1 The following papers may be referred to understand Micro ID technology presented in this document.

 Improvement in Reading Precision of Micro-ID Engraved on Wafer, ISSM2003, 2003/09/30

 Micro-ID Technology for Single Wafer Management, ISSM2002, 2002/10/17

 New Identification System for Individual Wafer Management, ISSM2000; Session II-6 (2000) Page33,

2000/9/26

R1-3 R2-2 SEMI Activities

R1-3.1 Additional information is gathered at the second round robin of the Micro ID Task Force.

R1-3.2 Many of such information turned out to be excellent and valuable in reading the Micro ID.

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant

literature, respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted

material or of an invention covered by patent rights. Komatsu Ltd. and Toshiba Corp. have filed a statement with

SEMI asserting that licenses will be made available to applicants throughout the world for the purpose of

implementing this standard without unfair discrimination. Attention is also drawn to the possibility that some

elements of this standard may be subject to patented technology or copyrighted items other than those identified

above. Semiconductor Equipment and Materials International (SEMI) shall not be held responsible for identifying

any or all such patented technology or copyrighted items. By publication of this standard, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights and

the risk of infringement of such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI T15-0705 © SEMI 2005 1

SEMI T15-0705

GENERAL SPECIFICATION OF JIG ID: CONCEPT

This standard was technically approved by the global Traceability Committee. This edition was approved for

publication by the global Audits and Reviews Subcommittee on May 20, 2005. It was available at

www.semi.org in June 2005 and on CD-ROM in July 2005.

1 Purpose

1.1 The purpose of this standard is to establish generic Jig ID to identify individual jigs uniquely, mounted on the

jig to process semiconductor devices.

2 Scope

2.1 This Standard specify the following contents of IDs to be installed onto the jigs used in the process of

semiconductor manufacturing.

 Types of IDs

 Data format

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish appropriate safety and health practices and determine the

applicability of regulatory or other limitations prior to use.

3 Limitation

3.1 This Standard does not restrict the communication protocol for communicating data of Jig ID.

3.2 This Standard does not provide the shape of tags in which the information of Jig ID is written.

3.3 This Standard does not specify the physical interfaces, such as the installation positions of Jig ID and reader or

reader/writer.

4 Referenced Standards and Documents

4.1 SEMI Standard

SEMI T12 — Specification of Tracing Jigs and Implements

4.2 Other Standard

ISO/IEC ISS 16022 — Information Technology - International Symbology Specification - Data Matrix

NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.

5 Terminology

5.1 Definition

5.1.1 Jig — a kind of attachment used to support measurement or production for material on one or more

equipment, as defined in SEMI T12.

5.1.2 Jig ID — an identifier installed onto a Jig, which is recognized to identify the individual piece.

5.2 Abbreviations and Acronyms

5.2.1 RFID — Radio Frequency Identification

6 Types of IDs

6.1 This Standard describes identification mechanism to allow automatic reading or writing as shown below.

 Barcodes