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SEMI E119-1104 © SEMI 2002, 2004 1 SEMI E119-1104 MECHANICAL SPECIFICATION FOR REDUCED-PITCH FRONT- OPENING BOX FOR INTERFACTO RY TRANSPORT OF 300 mm WAFERS This specificatio n was technically approved b y the Global Phy…

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SEMI E118.1-1104 © SEMI 2003, 2004 5
RELATED INFORMATION 1
SCENARIOS
NOTICE: This related information is not an official part of SEMI E118.1 and was derived from the work of the
originating task force. This related information was approved for publication by full letter ballot procedures on
January 10, 2003.
This section provides examples of typical scenarios for a Wafer ID Reader.
R1-1 Read WID
R1-1.1 The upstream controller sends a Read WID
Request message to the WIDR for Head 1. The WIDR
Head 1 reads the ID, and the WIDR returns the ID to
the upstream controller.
WIDR
Upstream
Controller
S18, F9 Read ID Request
Target ID = “01”
S18, F10 Read ID Data
MID = “XYZ001”
Figure R1-1
Read WID Scenario
R1-2 Read WID
R1-2.1 The upstream controller sends a Read WID
Request message to the WIDR for Head 1. The WIDR
Head 1 reads the ID, but the WIDR can't read the ID.
There isn't the ID on the wafer.
WIDR
Upstream
Controller
S18, F9 Read ID Request
Target ID = “01”
S18, F10 Read ID Data
Rsult Status = “EE”
MID = “”
Figure R1-2
Read WID Scenario
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer's instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E119-1104 © SEMI 2002, 2004 1
SEMI E119-1104
MECHANICAL SPECIFICATION FOR REDUCED-PITCH FRONT-
OPENING BOX FOR INTERFACTORY TRANSPORT OF 300 mm
WAFERS
This specification was technically approved by the Global Physical Interfaces and Carriers Committee and is
the direct responsibility of the North American Physical Interfaces and Carriers Committee. Current edition
approved by the North American Regional Standards Committee on August 16, 2004. Initially available at
www.semi.org September 2004; to be published November 2004. Originally published November 2002.
1 Purpose
1.1 This standard partially specifies a reduced-pitch
front-opening box for interfactory transport of 300 mm
wafers (FOBIT). This reduced-pitch box, with a
capacity of 25 wafers but with the approximate physical
volume of a 13-wafer FOUP, is intended to reduce the
cost of transporting wafers between IC manufacturing
sites. To leverage current industry 300 mm technology,
this reduced-pitch front-opening box is intended to
interface with 13-wafer FIMS, as specified in SEMI
E62.
2 Scope
2.1 This standard is intended to set an appropriate level
of specification that places minimal limits on
innovation while ensuring modularity and inter-
changeability at all mechanical interfaces. Only the
physical interfaces for FOBIT are specified; no
materials requirements or micro-contamination limits
are given. However, this standard has been written so
that both metal and injection-molded plastic FOBITs
can be manufactured in conformance with it.
2.2 This standard assumes that the FOBIT is intended
for use in the interfactory transportation of wafers. The
following boundary conditions were used in the
creation of this specification:
Minimizing the pitch between wafers will reduce
the cost of transporting wafers.
The FOBIT will be used for interfactory
transportation of both processed and unprocessed
wafers.
The box will have a 25-wafer capacity.
Random access of wafers, using edge grip handling
devices, is not a requirement for this standard.
The FOBIT will be compatible with the following
300 mm Standards:
13-wafer FIMS Interface (SEMI E62)
300 mm Load Port (SEMI E15.1)
Kinematic Coupling (SEMI E57)
The FOBIT will not necessarily be compliant with
the following 300 mm Standards due to wafer
restraint requirements and product applications
during transportation:
300 mm Front-Opening Unified Pod (SEMI E47.1)
300 mm Open Cassette (SEMI E1.9)
300 mm Front-Opening Shipping Box (SEMI
M31)
The technical requirements of this standard are
written for the transportation of nominal thickness
wafers, as defined by SEMI M1.15.
2.3 This reduced-pitch, 25-capacity FOBIT is designed
for use with the 13-capacity FIMS interface, as
specified in SEMI E62.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E1.9 — Mechanical Specification for Cassettes
Used to Transport and Store 300 mm Wafers
SEMI E15 — Specification for Tool Load Port
SEMI E15.1 — Specification for 300 mm Tool Load
Port
SEMI E47.1 — Provisional Mechanical Specification
for Boxes and Pods Used to Transport and Store 300
mm Wafers
SEMI E57 — Mechanical Specification for Kinematic
Couplings Used to Align and Support 300 mm Wafer
Carriers
SEMI E62 — Provisional Specification for 300 mm
Front-Opening Interface Mechanical Standard (FIMS)
SEMI E119-1104 © SEMI 2002, 2004 2
SEMI M1.15 — Standard for 300 mm Polished
Monocrystalline Silicon Wafers (Notched)
SEMI M31 — Provisional Mechanical Specification for
Front-Opening Shipping Box Used to Transport and
Ship 300 mm Wafers
SEMI S8 — Safety Guidelines for Ergonomics
Engineering of Semiconductor Manufacturing
Equipment
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 Definitions
4.1.1 bilateral datum plane — a vertical plane that
bisects the wafers and that is perpendicular to both the
horizontal and facial datum planes (as defined in SEMI
E57).
4.1.2 box — a protective portable container for a
carrier and/or substrate(s).
4.1.3 carrier — an open structure that holds one or
more substrates.
4.1.4 carrier bottom domain — volume (below z6
above the horizontal datum plane) that contains the
bottom of the carrier (as defined in SEMI E1.9).
4.1.5 carrier capacity — the number of substrates that
a carrier holds (as defined in SEMI E1.9).
4.1.6 carrier sensing pads — surfaces on the bottom of
the carrier for triggering optical or mechanical sensors
(as defined in SEMI E1.9).
4.1.7 carrier side domains — volumes (from z6 above
the horizontal datum plane to z15 above the top
nominal wafer seating plane) that contain the mizo teeth
or slots that support the wafer and the supporting
columns on the sides and rear of the carrier (as defined
in SEMI E1.9).
4.1.8 carrier top domain — volume (higher than z15
above the top wafer) that contains the top of the carrier
(as defined in SEMI E1.9).
4.1.9 facial datum plane — a vertical plane that bisects
the wafers and that is parallel to the front side of the
carrier (where wafers are removed or inserted). On tool
load ports, it is also parallel to the load face plane
specified in SEMI E15 on the side of the tool where the
carrier is loaded and unloaded (as defined in SEMI
E57).
4.1.10 front-opening box for interfactory transport
(FOBIT) — a transportation box with a front-opening
interface (that mates with a FIMS port that complies
with SEMI E62).
4.1.11 front-opening shipping box (FOSB) — a
shipping box (that complies with SEMI M31) with a
front-opening interface.
4.1.12
front-opening unified pod (FOUP) — a box
(that complies with SEMI E47.1) with a non-removable
cassette (so that its interior complies with SEMI E1.9)
and with a front-opening interface (that mates with a
FIMS port that complies with SEMI E62).
4.1.13 horizontal datum plane — a horizontal plane
from which projects the kinematic-coupling pins on
which the carrier sits. On tool load ports, it is at the load
height specified in SEMI E15 and might not be
physically realized as a surface (as defined in SEMI
E57).
4.1.14 minienvironment — a localized environment
created by an enclosure to isolate the product from
contamination and people.
4.1.15 nominal wafer centerline — the line that is
defined by the intersection of the two vertical datum
planes (facial and bilateral) and that passes through the
nominal centers of the seated wafers (which must be
horizontal when the carrier is placed on the coupling)
(as defined in SEMI E57).
4.1.16 optical wafer sensing paths — lines of sight for
optically sensing the positions of the wafers. Several
horizontal optical wafer sensing paths are present in
between the carrier side domains. In addition, two
vertical optical wafer sensing paths are created by
rectangular exclusion zones in the front of the carrier
top and bottom (as defined in SEMI E1.9).
4.1.17 shipping box — a protective portable container
for a carrier and/or wafer(s) that is used to ship wafers
from the wafer suppliers to their customers.
4.1.18 virtual tracking unit — an entity (which could
be a number of substrates or an individual die or mask
group) that the factory floor control system treats as a
single unit for tracking purposes (as defined in SEMI
E1.9).
4.1.19 wafer carrier — any cassette, box, pod, or boat
that contains wafers (as defined in SEMI E15).
4.1.20 wafer extraction volume — the open space for
extracting a wafer from the carrier (as defined in SEMI
E1.9).
4.1.21 wafer pick-up volume — the space that contains
entire bottom of a wafer if the wafer has been pushed to
the rear of the carrier (as defined in SEMI E1.9).
4.1.22 wafer set-down volume — the open space for
inserting and setting down a wafer in the carrier (as
defined in SEMI E1.9).