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SEMI E129-1103 © SEMI 2003 24 ESD TR02 — High Resistance Ohmm eters – Voltage Measurements ESD TR03 — Glove & Finger Cots ESD TR05 — Consi d eration f or Devel oping ESD Garment Specifications ESD TR06 — Static Elect…

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SEMI E129-1103 © SEMI 2003 23
• EN 61340-5-1 (formerly CENNELEC100015) —
As a European Normative Standard (EN), this
document has considerable influence among the
European Common Market (ECM) countries and
those that supply products to the ECM. The
content of this document is identical to IEC 61340-
5-1.
• JEDEC JESD625 — A revision of EIA 625, this
document provides a great deal of information
regarding ESD-program planning, implementation
and auditing. The technical requirements are
harmonized fairly well with the above referenced
documents.
• ANSI ESD S20.20 — Technical requirements are
similar to those stated in the above documents but
the administrative requirements are quite different.
ANSI ESD S20.20 was written to comply with ISO
9001-2000 type requirements for validation,
verification and maintenance. Adopted by the US
Department of Defense (DoD), National
Aeronautics and Space Administration (NASA),
Food and Drug Administration (FDA), and
numerous corporations, ANSI ESD S20.20 is the
only ESD-program standard that has an official
certification program. ISO 9000 registrars have
been trained and others are in training at this time
to allow them to provide officially recognized
audits leading to certification granted by the ISO
registrar and the ESD Association.
• The ESD Association is the certifying body that
recognizes trained registrar companies. At this
time, four registrar companies have trained
personnel on staff that can support certification
audits throughout most of Asia, North America and
much of Europe. Numerous other registrars are
being asked by their ISO/QS clients about ANSI
ESD S20.20 certification so the list of certified
registrars is expected to grow over time.
R2-12 References
R2-12.1 SEMI Standards
SEMI E78 — Electrostatic Compatibility – Guide to
Assess and Control Electrostatic Discharge (ESD) and
Electrostatic Attraction (ESA) for Equipment
R2-12.2 ASTM Standards
ASTM D882 — Standard Test Method for Tensile
Properties of Thin Plastic Sheeting
ASTM D1003 — Standard Test Method for Haze and
Luminous Transmittance of Transparent Plastics
ASTM D1922 — Standard Test Method for
Propagation Tear Resistance of Plastic Film and Thin
Sheeting by Pendulum Method
ASTM E595 — Total Mass Loss and Collected Volatile
Condensable Materials from Outgassing in A Vacuum
Environment
ASTM E1235 — Standard Test Method for
Gravimetric Determination of Nonvolatile Residue
(NVR) in Environmentally Controlled Areas for
Spacecraft
ASTM F88 — Standard Test Method for Seal Strength
of Flexible Barrier Materials
ASTM F331 — Standard Test Method for Nonvolatile
Residue of Solvent Extract from Aerospace
Components (Using Flash Evaporator)
R2-12.3 ESD Association Standards and Advisories
ANSI ESD S1.1 — Evaluation, Acceptance, and
Functional Testing of Wrist Straps
ANSI ESD S4.1 — Worksurfaces – Resistance
Measurements
ANSI ESD S11.31 — Evaluating the Performance of
Electrostatic Discharge Shielding Bags
ANSI ESD S20.20 — Standard for the Development of
an ESD Control Program
ANSI ESD STM2.1 — Resistance Test Method for
Electrostatic Discharge Protective Garments
ANSI ESD STM4.2 — Worksurfaces – Charge
Dissipation Characteristics
ANSI ESD STM11.12 — Volume Resistance
Measurement of Static Dissipative Planar Materials
ANSI ESD STM12.1 — Seating Resistive
Characterization
ANSI ESD STM97.1 — Floor Materials and Footwear
– Resistance in Combination with a Person
ESD ADV11.2 — Triboelectric Charge Accumulation
Testing
ESD S6.1 — Grounding – Recommended Practice
ESD SP10.1 — Automated Handling Equipment
ESD STM7.1 — Floor Materials – Resistive
Characterization of Materials
ESD STM11.11 — Surface Resistance Measurement of
Static Dissipative Planar Materials
ESD STM97.2 — Floor Materials and Footwear -
Voltage Measurement in Combination with a Person
SEMI E129-1103 © SEMI 2003 24
ESD TR02 — High Resistance Ohmmeters – Voltage
Measurements
ESD TR03 — Glove & Finger Cots
ESD TR05 — Consideration for Developing ESD
Garment Specifications
ESD TR06 — Static Electricity Hazards of
Triboelectrically Charged Garments
ESD TR11 — Electrostatic Guidelines and
Considerations for Cleanrooms and Clean
Manufacturing
R2-12.4 Federal Standards
FED-STD-101/4046 — Electrostatic Properties of
Materials
FED-STD-101/2065 — Puncture Resistance and
Elongation Test (1/8 Inch Radius Probe Method)
R2-12.5 IDEMA Documents
IDEMA M7 — Organic Contamination as Nonvolatile
Residue (NVR)
IDEMA M9 — Particulate Contamination Test
Methods for Hard Disk Drive Components
IDEMA M11 — General Outgas Test Procedure by
Dynamic Headspace Analysis
IDEMA M12 — Measurement of Extractable
/Leachable Cation Contamination Levels on Drive
Components by Ion Chromatography (IC)
R2-12.6 IEC Documents
IEC EN 61340-5-1 — Electrostatics
– Part 5.1:
Protection of electronic devices from electrostatic
phenomena — General Requirements.
IEC EN 61340-5-2 — Electrostatics – Part 5.2:
Protection of electronic devices from electrostatic
phenomena – Users’ Guide – Elements of a Static
Control Program
R2-12.7 Other Documents
ANSI IEEE STD 142 — IEEE Recommended Practice
for Grounding of Industrial and Commercial Power
Systems
ANSI NFPA 70 — National Electrical Code
ARP 598 — The Determination of Particulate
Contamination in Liquids by the Particle Count Method
ISO 14644 — Cleanrooms and Associated Controlled
Environments
NASA KSC-C-123 — Specification for Surface
Cleanliness of Fluid Systems
IEST-STD-CC1246D — Product Cleanliness Levels
and Contamination Control Program
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
R2-13 Acknowledgement
Contributed by David E. Swenson, Affinity Static
Control Consulting, 2609 Quanah Drive, Round Rock,
TX 78681
email: static2@swbell.net
SEMI E129-1103 © SEMI 2003 25
RELATED INFORMATION 3
MEASURING ELECTROMAGNETIC INTERFERENCE FROM ESD
NOTICE: The material contained in this related information is not an official part of SEMI E129 and is not
intended to modify or supersede the guide in any way. These notes are provided as a source of information to aid in
the application of the guide, and are to be considered reference material. Determination of the suitability of the
material is solely the responsibility of the user. This related information was approved by full letter ballot
procedures on September 3, 2003.
R3-1 Background
R3-1.1 Electrostatic discharges (ESD events) generate
strong electromagnetic fields that cause undesirable
behavior of electronics equipment generally by
inducing extraneous voltages and currents into its
circuits. There are many other sources of
electromagnetic interference (EMI) in the
semiconductor-manufacturing environment that also
cause similar effects. EMI is propagated via different
means such as air, cables and even imperfectly installed
grounding networks.
R3-1.2 There are several regional and international
standards regulating EMI susceptibility and parasitic
emission of electronics products. Compliance of
equipment with those standards is not a guarantee of
complete immunity to EMI for several reasons, among
which are:
• EMI conditions in semiconductor manufacturing
environments often exceed the limits set forth by
those standards.
• EMI performance of equipment can be
substantially affected by installation, although
EMC compliance testing does not take this into
account.
• Interconnection of tools in the actual production
environment creates a network of tools, which has
its own EMI properties that are never tested during
product design and approval cycle.
There are neither guidelines nor regulations at the
moment to guide EMI-conscious design of facilities or
to properly maintain them in that regard. It would be
beneficial to provide (at minimum) guidelines to
cleanroom designers and maintenance personnel to
assist them in implementing good EMI practices in their
facilities.
R3-2 EMI GENERATION
R3-2.1 Controlling EMI generation is a key component
in EMI management. There are several types of
generators of electromagnetic emission that can
eventually cause EMI.
• ESD events (discharges)
• Parasitic emission from equipment
• Intentional emission from equipment that uses
electromagnetic fields as a part of the process
R3-2.2 An ESD event is characterized by a very rapid
transfer of electric charges. As a result, a very fast
transient electromagnetic field is generated. The effect
on the equipment is determined not only by the voltage
that was discharged by the ESD event, but also by the
charge that was dissipated during the event and the
properties of contact. Another important parameter in
assessing EMI impact of ESD events is the propagating
properties of the discharging parts. More effective
antennas lead to a higher magnitude of electromagnetic
field.
R3-2.3 Parasitic emissions from equipment are a side
product of normal operation of equipment. Though
FCC, CE or similar regulations tightly control parasitic
emission, in actual installations these emissions are
often higher than expected. This is often attributed to
high tool densities, extra long cabling, partially engaged
connectors, and often-open covers that are supposed to
attenuate electromagnetic emission from these cables.
R3-2.4 Intentional radiation generated by some types
of tools causes substantial EMI as a part of normal
operation. Examples include CVD tools and ion
implanters.
R3-2.5 EMI Propagation
R3-2.5.1 Controlling the propagation path is another
key component in EMI management. Electromagnetic
field propagation paths include:
• Radiated – via air
• Conducted – via cables and wires
• Combined – an example of such is EMI picked up
from the air by a cable or a wire and carried into
equipment as a conducted emission.
R3-2.5.2 Poor grounding and power distribution
networks provide paths for EMI to propagate from one
tool to another. It is not uncommon to witness EMI
from one corner of a cleanroom to manifest itself in
another, distant corner.