00197674-01-UM-E-Series-EN-05-2015 - 第98页
2 Operational safety User manual SIPLACE E 2.11 ESD guidelines From software version SC 708.0 05/2015 Editi on 98 Do not move the assemblies near to data view devices, monitors or television units. Keep a min - imum dist…
User manual SIPLACE E 2 Operational safety
From software version SC 708.0 05/2015 Edition 2.11 ESD guidelines
97
2.11 ESD guidelines
2.11.1 What does ESD mean?
Almost all of the modules in use today are equipped with highly integrated MOS blocks and com
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ponents. The manufacturing techniques used mean that these electronic components are ex
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tremely sensitive to overvoltage and thus to electrostatic discharge.
The abbreviation for such modules is 'ESD' (Electrostatic Sensitive Device). ’ESD’ is used inter
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nationally. The following symbol on cabinet typeplates, racks or packaging indicates that compo
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nents which are sensitive to electrostatic discharge have been used and that the modules
concerned are also touch-sensitive.
ESDs can be destroyed by voltages and power levels that are far below the level
that can be perceived by humans. Such voltages occur if a person touches a com
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ponent or module without earthing themselves. Components that are exposed to
such overvoltages do not generally appear to be defective immediately - incorrect
behavior starts after the component or module has been in operation for some time.
2.11.2 Important measures to protect against static charging
Most plastics can easily become charged and must therefore be kept away from at-risk com
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ponents.
Always ensure that people, the workplace and packaging are safely earthed when handling
electrostatic sensitive components.
2.11.3 Handling ESD modules
Do not touch electronic modules unless it is absolutely essential to do so in order to carry out other
work. If it is necessary, make sure that you do not touch the pins or printed conductors when you
pick up flat modules.
Do not touch components unless
you are constantly earthed by an ESD wrist strap or
you are wearing ESD shoes or ESD shoe earthing strips on an ESD floor.
Always discharge yourself before you touch an electronic module. To do this, simply touch a con
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ductive and earthed object immediately before you touch the module (such as unpainted parts of
a switch cabinet, a water pipe, etc.).
Do not allow modules with chargeable and highly insulating materials to touch one another, e.g.
plastic films, insulating table surfaces or items of clothing made from synthetic fibers.
Always place the modules on a conductive surface (table with an ESD coating, conductive ESD
foam, ESD bag or container).
2 Operational safety User manual SIPLACE E
2.11 ESD guidelines From software version SC 708.0 05/2015 Edition
98
Do not move the assemblies near to data view devices, monitors or television units. Keep a min
-
imum distance of > 10 cm to monitors.
2.11.4 Measurements and modifications to ESD modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
Always use an earthed soldering iron if you carry out any soldering work.
2.11.5 Dispatching ESD modules
Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack
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aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex
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ample. NEVER use plastic bags or film. 2
If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
User manual SIPLACE E 3 Technical data and assemblies
From software version SC 708.0 05/2015 Edition 3.1 Overview of technical data
99
3 Technical data and assemblies
3.1 Overview of technical data
3.1.1 Placement head configuration - optimum values
3.1.2 Placement machine - optimum values
3
Placement Head CP14 CP12 CP12/PP CP6/PP TH
E-Component
Range
01005 to
6 x 6mm
01005 to
18.7 x 18.7 mm
01005 to
45 x 98 mm
0201 to
45 x 98 mm
0201 to
200 x 110 mm
E-Component
Height
4 mm 7.5 mm 19 mm
*a
*)a One nozzle of CP12 is removed. 8.5 mm if no nozzle of CP12 is removed.
19 mm
*b
*)b One nozzle of CP6 is removed. 8.5 mm if no nozzle of CP6 is removed.
25 mm
E-Accuracy (3σ) 41µm 41µm 37.5µm 37.5µm 22µm
E-Speed 45,300 cph 24,300 cph 24,200 cph 13,700 cph 5,200 cph
Placement
Machine
SIPLACE E
Heads CP14 CP12 CP12/PP CP6/PP TH
Board format
(length
*a
x width)
*)a With „Long board“ option
1200 mm x 460 mm
Feeder capacity 120 x SIPLACE SmartFeeder 8 mm E
PCB thickness 0.3 - 4.5 mm
PCB weight
*b
*)b The board weight value refers to the weight of the board plus the weight of the components
up to 2 kg
Air Consumption 90 NL/Min. 90 NL/Min. 140 NL/Min. 140 NL/Min. 185 NL/Min.
Machine dimen
-
sion (L x W)
*c
*)c Without changeover table or fixed table
1,500 mm x 1,666mm
Machine
weight
*d
*)d Single sided machine
1,850 kg