HM_Series_Administrator′s_Guide(Chi_Ver2.5)校正 - 第370页

12-2 Cutting-edge Modular Mounter HM Series A dministrator's Guide  电路电路板位置  Individual Unit Ca libration  Feeder Base Position  T ray Position  W afer Unit Origin Position (For HM520h)  W afer Unit Position M…

12-1

校正

第12章. 校正

12.1. 校正

注意 重新执行已完成的Calibration时，该Calibration以后的全部项目

也需再次执行。

为了获得准确的Calibration数据，请在设备运转二个小时后执行

Calibration。

用于执行与XY Gantry, Conveyor 及 Camera 有关的校正。

执行校正之前需要确认或先行的作业为如下。

 I/O Test

 确认ANC Type

 确认空压是否异常

执行校正的顺序和相应校正所需的校正 Tool 为如下

 轴原点(以维修工程师的权限实行)

 基准摄像头值(Fiducial Camera Calibration)

 公共的 XY(Gantry Common XY)

 传送带刻度

 X-XY轴修正

 悬臂热补偿

 ANC 位置扫描仪(ANC Position Scan)

 贴装头 & 照明机校准(Head & Camera Calibration)

 High Speed Head(HSH)

HNHeadXY Nozzle, HNFidMap Nozzle, HNFixMap Nozzle, HNHeadZ Nozzle

 Multi Function Head(MFH)

CNHeadXY Nozzle, CNFixMap Nozzle, CNFidMap Nozzle, CN065 Nozzle

12-2

Cutting-edge Modular Mounter HM Series Administrator's Guide

 电路电路板位置

 Individual Unit Calibration

 Feeder Base Position

 Tray Position

 Wafer Unit Origin Position (For HM520h)

 Wafer Unit Position Mapping (For HM520h)

 Wafer Unit Fid Distortion Mapping (For HM520h)

Calibration High Speed Multi Functional

Rough R-Axis HomeOffset Ο

Up Camera Scale 1 ΟΟ

Fid to Up Camera Hole Offset1 ΟΟ

Head Z-Axis Home Offset Ο

Light Mapping ΟΟ

Fine R-Axis Home Offset Ο

Up Camera Scale 2 ΟΟ

Fid to Up Camera Hole Offset2 ΟΟ

Head T-Axis Home Offset Ο

Head T-Axis Offset Ο

Nozzle Holder Inspection ΟΟ

Head Block COR Ο

Head Block Center Ο

Head Block Ref.Mark ΟΟ

Up C9amera Thermal Pos ΟΟ

Head Z Offset ΟΟ

Head Offset ΟΟ

SVS Z Position (SVS Camera) ΟΟ

Height Sensor Offset (Option) ΟΟ

12-3

校正

 Wafer Unit Pin Z Pos Teach (For HM520h)

 EJPinZ Nozzle

 User Dump Position

 Mount Offset(以维修工程师的权限实行)

备注无法执行悬臂1~2的基准摄像头间距校正6时，‘3.Gantry

Common X-Y’以后的校准键将全部变成非激活状态。

 Head Auto Calibration

 High Speed Head (HSH)

HNHeadXY Nozzle