MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第11页

MIL-STD-883F 5 ASTM E 722 - Standard Pr actic e for Charac terizing Ne utr on Energy Fl uence Spec tra i n Terms of an equival ent Monoe nergeti c Neutr on Fluenc e for Radi ation- Hardnes s Testi ng of Elect ronics . AS…

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2.3 Non-Government publications
. The following documents form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
INTERNATIONAL ORGANIZATION FOR STANDARDIZATION (ISO) STANDARDS
ISO 14644-1 - Cleanrooms and Associated Controlled Environments – Part 1: Classification of Air
Cleanliness.
ISO 14644-2 - Cleanrooms and Associated Controlled Environments – Part 2: Specifications for
Testing and Monitoring to Prove Confinued Compliance with ISO 14644-1.
(Copies of these documents are available online at http://iest.org
or from the Institute of Environmental Sciences and
Technology (IEST), 940 East Northwest Highway, Mount Prospect, IL 60056-3444.)
INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
ANSI/IUPC-T-50 - Terms and Definitions.
(Copies of these documents are available online at http://ipc.org
or from the Institute for Interconnecting and Packaging
Electronic Circuits, 7380 N. Lincoln Avenue, Lincolnwood, IL 60616.)
AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI)
ANSI/NCSL Z540-1 - Calibration Laboratories and Measuring and Test Equipment,
General Requirements
ANSI/J-STD-004 - Requirements for Soldering Fluxes
ANSI/J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-fluxed Solid
Solders for Electronic Soldering Applications
(Copies of these documents are available online at http://ansi.org
or from to the American National Standards
International, 25 West 43
RD
Street, 4
TH
Floor, New York, NY 10036)
ELECTRONICS INDUSTRIES ALLIANCE
IPC/EIA/JEDEC J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires.
EIA/JESD78 IC Latch-up Test.
EIA-557-A Statistical Process Control Systems.
(Copies of these documents are available online at http://www.eia.org
or from the Electronic Industries Alliance, 2500
Wilson Boulevard, Arlington, VA 22201-3834; or to IPC, 2215 Sanders Road, Northbrook, IL 60062-6135.)
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM E 263 - Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation
of Iron.
ASTM E 264 - Standard Test Method for Measuring Fast-Neutron Reaction Rates by Radioactivation
of Nickel.
ASTM E 265 - Standard Test Method for Measuring Reaction Rates and Fast-Neutron Fluences by
Radioactivation of Sulfur-32.
ASTM E 526 - Standard Method for Measuring Dose for Use in Linear Accelerator Pulsed Radiation
Effects Tests.
ASTM E 666 - Standard Practice for Calculating Absorbed Dose from Gamma or X-Radiation.
ASTM E 668 - Standard Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for
Determining Absorbed Dose on Radiation-Hardess Testing of Electronic Devices.
ASTM E 720 - Standard Guide for Selection and Use of Neutron Sensors for Determining Neutron
Spectra Employed in Radiation-Hardness Testing of Electronics.
ASTM E 721 - Standard Method for Determining Neutron Energy Spectra with Neutron-Activation Foils
for Radiation-Hardness Testing of Electronics.
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MIL-STD-883F
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ASTM E 722 - Standard Practice for Characterizing Neutron Energy Fluence Spectra in Terms of an
equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of
Electronics.
ASTM E 1249 - Minimizing Dosimetry Errors in Radiation Hardness Testing of Silicon Electronic
Devices.
ASTM E 1250 - Standard Method for Application of Ionization Chambers to Assess the Low Energy
Gamma Component of Cobalt 60 Irradiators Used in Radiation Hardness Testing of
Silicon Electronic Devices.
ASTM E 1275 - Standard Practice for Use of a Radiochromic Film Dosimetry System.
ASTM F 458 - Standard Practice for Nondestructive Pull Testing of Wire Bonds.
ASTM F 459 - Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds.
ASTM F 1892 - Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor
Devices.
ASTM C 177 - Standard Test Method for Steady-State Heat Flux Measurements and Thermal
Transmission Properties by Means of the Guarded Hot-Plate Apparatus.
ASTM C 518 - Standard Test Method for Steady-State Heat Flux Measurements and Thermal
Transmission Properties by Means of the Heat Flow Meter Apparatus.
ASTM D 150 - Standard Test Methods for A-C Loss Characteristics and Permittivity (Dielectric
Constant) of Solid Electrical Insulating Materials.
ASTM D 257 - Standard Test Methods for D-C Resistance or Conductance of Insulating Materials.
ASTM D 1002 - Standard Test Method for Strength Properties of Adhesives in Shear by Tension
Loading (Metal-to-Metal).
ASTM D 3386 - Coefficient of Linear Thermal Expansion of Electrical Insulating Materials, Test Method
for.
ASTM D 3850 - Rapid Thermal Degradation of Solid Electrical Insulating Materials by
Thermogravimetric Method, Test Method for.
(Copies of these documents are available online at http://www.astm.org
or from the American Society for Testing and
Materials, P O Box C700, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959)
(Non-Government standards and other publications are normally available from the organizations that prepare or
distribute the documents. These documents also may be available in or through libraries or other informational services.)
2.4 Order of precedence
. In the event of a conflict between the text of this document and the references cited herein, the
text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
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3. ABBREVIATIONS, SYMBOLS, AND DEFINITIONS
3.1 Abbreviations, symbols, and definitions
. For the purpose of this standard, the abbreviations, symbols, and definitions
specified in MIL-PRF-19500, MIL-PRF-38535, or MIL-HDBK-505 shall apply. The following definitions shall also apply:
3.1.1 Microelectronic device
. A microcircuit, microcircuit module, or an element of a microcircuit as defined in appendix A
of MIL-PRF-38535. For the purposes of this document, each type of microelectronic device shall be identified by a unique
type, or drawing number.
3.1.2 Mode of failure
. The cause for rejection of any failed device or microcircuit as defined in terms of the specific
electrical or physical requirement which it failed to meet (i.e., no failure analysis is required to identify the mode of failure,
which should be obvious from the rejection criteria of the test method).
3.1.3 Mechanism of failure
. The original defect which initiated the microcircuit or device failure or the physical process by
which the degradation proceeded to the point of failure, identifying quality defects, internal, structural, or electrical weakness
and, where applicable, the nature of externally applied stresses which led to failure.
3.1.4 Absolute maximum ratings
. The values specified for ratings, maximum ratings, or absolute maximum ratings are
based on the "absolute system" and are not to be exceeded under any measurable or known service or conditions. In
testing microelectronic devices, limits may be exceeded in determining device performance or lot quality, provided the test
has been determined to be nondestructive and precautions are taken to limit device breakdown and avoid conditions that
could cause permanent degradation. These ratings are limiting values beyond which the serviceability of any individual
microelectronic integrated circuit may be impaired. It follows that a combination of all the absolute maximum ratings cannot
normally be attained simultaneously. Combinations of certain ratings are permissible only if no single maximum rating is
exceeded under any service condition. Unless otherwise specified, the voltage, current, and power ratings are based on
continuous dc power conditions at free air ambient temperature of 25°C ±3°C. For pulsed or other conditions of operation of
a similar nature, the current, voltage, and power dissipation ratings are a function of time and duty cycle. In order not to
exceed absolute ratings, the equipment designer has the responsibility of determining an average design value, for each
rating, below the absolute value of that rating by a safety factor, so that the absolute values will never be exceeded under
any usual conditions of supply-voltage variations, load variations, or manufacturing variations in the equipment itself.
The values specified for "Testing Ratings" (methods 1005, 1008, 1015, 5004, and 5005) are intended to apply only to
short-term, stress-accelerated storage, burn-in, and life tests and shall not be used as basis for equipment design.
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