MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第13页

MIL-STD-883F 7 3.1.5 W orst case c ondit ion . W or st c ase c ondition( s) consi sts of the s imult aneous appli cati on of the mos t advers e (in terms of requi red func tion of the devic e) values (wi thin the s tated…

MIL-STD-883F

3. ABBREVIATIONS, SYMBOLS, AND DEFINITIONS

3.1 Abbreviations, symbols, and definitions

. For the purpose of this standard, the abbreviations, symbols, and definitions

specified in MIL-PRF-19500, MIL-PRF-38535, or MIL-HDBK-505 shall apply. The following definitions shall also apply:

3.1.1 Microelectronic device

. A microcircuit, microcircuit module, or an element of a microcircuit as defined in appendix A

of MIL-PRF-38535. For the purposes of this document, each type of microelectronic device shall be identified by a unique

type, or drawing number.

3.1.2 Mode of failure

. The cause for rejection of any failed device or microcircuit as defined in terms of the specific

electrical or physical requirement which it failed to meet (i.e., no failure analysis is required to identify the mode of failure,

which should be obvious from the rejection criteria of the test method).

3.1.3 Mechanism of failure

. The original defect which initiated the microcircuit or device failure or the physical process by

which the degradation proceeded to the point of failure, identifying quality defects, internal, structural, or electrical weakness

and, where applicable, the nature of externally applied stresses which led to failure.

3.1.4 Absolute maximum ratings

. The values specified for ratings, maximum ratings, or absolute maximum ratings are

based on the "absolute system" and are not to be exceeded under any measurable or known service or conditions. In

testing microelectronic devices, limits may be exceeded in determining device performance or lot quality, provided the test

has been determined to be nondestructive and precautions are taken to limit device breakdown and avoid conditions that

could cause permanent degradation. These ratings are limiting values beyond which the serviceability of any individual

microelectronic integrated circuit may be impaired. It follows that a combination of all the absolute maximum ratings cannot

normally be attained simultaneously. Combinations of certain ratings are permissible only if no single maximum rating is

exceeded under any service condition. Unless otherwise specified, the voltage, current, and power ratings are based on

continuous dc power conditions at free air ambient temperature of 25°C ±3°C. For pulsed or other conditions of operation of

a similar nature, the current, voltage, and power dissipation ratings are a function of time and duty cycle. In order not to

exceed absolute ratings, the equipment designer has the responsibility of determining an average design value, for each

rating, below the absolute value of that rating by a safety factor, so that the absolute values will never be exceeded under

any usual conditions of supply-voltage variations, load variations, or manufacturing variations in the equipment itself.

The values specified for "Testing Ratings" (methods 1005, 1008, 1015, 5004, and 5005) are intended to apply only to

short-term, stress-accelerated storage, burn-in, and life tests and shall not be used as basis for equipment design.

MIL-STD-883F

3.1.5 Worst case condition

. Worst case condition(s) consists of the simultaneous application of the most adverse (in

terms of required function of the device) values (within the stated operating ranges) of bias(es), signal input(s), loading and

environment to the device under test. Worst cases for different parameters may be different. If all the applied test

conditions are not established at the most adverse values, the term "partial worst case condition" shall be used to

differentiate and shall be accompanied by identification of the departure from worst case. For example, the lowest values of

supply voltages, signal input levels, and ambient temperature and the highest value of loading may constitute "worst case

conditions" for measurement of the output voltage of a gate. Use of the most adverse values of applied electrical conditions,

at room temperature, would then constitute "partial worst case conditions" and shall be so identified using a postscript "at

room temperature."

3.1.5.1 Accelerated test condition

. Accelerated test conditions are defined as test conditions using one or more applied

stress levels which exceed the maximum rated operating or storage stress levels but are less than or equal to the "Testing

Rating" values.

3.1.6 Static parameters

. Static parameters are defined as dc voltages, dc currents, or ratios of dc voltages or dc

currents, or both.

3.1.7 Dynamic parameters

. Dynamic parameters are defined as those which are rms or time-varying values of voltages

or currents, or ratios of rms or time-varying values of voltages or currents, or both.

3.1.8 Switching parameters

. Switching parameters are defined as those which are associated with the transition of the

output from one level to another or the response to a step input.

3.1.9 Functional tests

. Functional tests are defined as those go, no-go tests which sequentially exercise a function (truth)

table or in which the device is operated as part of an external circuit and total circuit operation is tested.

3.1.10 Acquiring activity

. The acquiring activity is the organizational element of the Government which contracts for

articles, supplies, or services; or it may be a contractor or subcontractor when the organizational element of the Government

has given specific written authorization to such contractor or subcontractor to serve as agent of the acquiring activity. A

contractor or subcontractor serving as agent of the acquiring activity shall not have the authority to grant waivers, deviations,

or exceptions unless specific written authorization to do so has also been given by the Government organization.

3.1.11 Accuracy

. The quality of freedom from error. Accuracy is determined or assured by calibration, or reliance upon

calibrated items.

3.1.12 Calibration

. Comparison of measurement standard or instrument of known accuracy with another standard,

instrument or device to detect, correlate, report or eliminate by adjustment, any variation in the accuracy of the item being

compared. Use of calibrated items provide the basis for value traceability of product technical specifications to national

standard values. Calibration is an activity related to measurement and test equipment performed in accordance with

ANSI/NCSL Z540-1 or equivalent.

MIL-STD-883F

3.1.13 Precision

. The degree to which an instrument, device, assemblage, test, measurement or process exhibits

repeatability. Expressed statistically or through various techniques of Statistical Process Control (SPC). Term is used

interchangeably with "repeatability".

3.1.14 Resolution

. The smallest unit of readability or indication of known value in an instrument, device or assemblage

thereof.

3.1.15 Standard reference material (SRM)

. A device or artifact recognized and listed by the National Institute of

Standards and Technology (NIST) as having known stability and characterization. SRM's used in product testing provide

traceability for technical specifications. SRM's do not require calibration when used and stored in accordance with NIST

accompanying instructions. They are used as "certified materials".

3.1.16 Tolerance

. A documented range over which a specified value may vary.

3.1.17 Test accuracy ratio (TAR)

. A ratio of the tolerance of the device under test to the accuracy of the related

measuring or test instrument or to the accuracy of the correlation device/SRM.

3.1.18 Uncertainty

. An expression of the combined errors in a test measurement process. Stated as a range within

which the subject quantity is expected to lie. Comprised of many components including: estimates of statistical distribution

and results of measurement or engineering analysis. Uncertainty established with a suitable degree of confidence, may be

used in assuring or determining product conformance and technical specifications.

3.1.19 Susceptibility

. The point at which a device fails to meet the postirradiation end-point electrical parameter limits or

fails functionally during radiation exposure (e.g., neutron irradiation).

3.1.20 Class M

. Class M is defined as 1.2.1 compliant product or product built in compliance to Appendix A of MIL-PRF-

38535 documented on a Standard Microcircuit Drawing where configuration control is provided by the Government preparing

activity. Class M devices shall use the conditions specified in the test methods herein for class level B product.

3.1.21 Class level B and class level S

. 2 class levels are used in this document to define requirements for high reliability

military applications (Class level B) and space applications (Class level S). Class level B requirements contained in this

document are intended for use for Class Q, Class H, and Class M products, as well as Class B M38510 JAN slash sheet

product. Class level B requirements are also intended for use for product claimed as 883 compliant or 1.2.1 compliant for

high reliability military applications. Class level S requirements contained in this document are intended for use for Class V,

Class K, as well as M38510 Class S JAN slash sheet product. Class level S requirements are also intended for use for

product claimed as 883 compliant or 1.2.1 compliant for space level applications.

4. GENERAL REQUIREMENTS

4.1 Numbering system

. The test methods are designated by numbers assigned in accordance with the following system:

4.1.1 Classification of tests

. The tests are divided into four classes:

1001 to 1999 Environmental tests

2001 to 2999 Mechanical tests

3001 to 4999 Electrical tests

5001 to 5999 Test procedures