MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第142页

MIL-STD-883F METHOD 1021.2 15 November 1991 4 b. Topologi cal anal ysis approach. If a phot omicr ograph of t he cir cuit is avai lable, the number of r equired s tates can be reduced by examini ng the topology of the in…

MIL-STD-883F

METHOD 1021.2

15 November 1991

2.3 Test circuit

. The test circuit shall contain the device under test, wiring, and auxiliary components as required. It shall

allow for the application of power and bias voltages or pulses at the device inputs to establish the state vector. Power

supply stiffening capacitors shall be included which keep the power supply voltage from changing more than 10 percent of

its specified value during and after the radiation pulse. They should be placed as close to the device under test as possible,

but should not be exposed to the direct radiation beam. Provision shall be made for monitoring specified outputs.

Capacitive loading of the test circuit must be sufficiently low to avoid interference with the measurement of short-duration

transient signals. Generally a line driver is required at device outputs to reduce capacitive loading. Line drivers must have

sufficient risetime, linearity, and dynamic range to drive terminated cables with the full output logic level. The test circuit

shall not affect the measured output response over the range of expected dose rates and shall not exhibit permanent

changes in electrical characteristics at the expected accumulated doses. It must be shielded from the radiation to a

sufficient level to meet these criteria.

Test circuit materials and components shall not cause attenuation or scattering which will perturb the uniformity of the beam

at the test device position (see 2.1 for uniformity). The device under test shall be oriented so that its surface is

perpendicular to the radiation beam.

2.4 Cabling

. Cabling shall be provided to connect the test circuit board, located in the radiation field, to the test

instrumentation located in the instrumentation area. Coaxial cables, terminated in their characteristic impedance, shall be

used for all input and output signals. Double shielded cables, triax, zipper tubing or other additional shielding may be

required to reduce noise to acceptable levels.

2.5 Transient signal measurement

. Oscilloscopes or transient digitizers are required to measure transient output

voltages, the power supply current and the dosimeter outputs. The risetime of the measuring instrumentation shall be less

than 10 ns for pulse widths greater than 33 ns or less than 30 percent of the radiation pulse width for pulse widths less than

33 ns.

2.6 Functional testing

. Equipment is also required for functional testing of devices immediately after the radiation pulse in

the radiation test fixture. This equipment must contain sources to drive inputs with specified patterns, and comparison

circuitry to determine that the correct output patterns result. This equipment may consist of logic analyzers, custom circuitry,

or commercial integrated circuit test systems. However, it must be capable of functioning through long cables, and must

also be compatible with the line drivers used at the outputs of the device in the test circuit.

2.7 General purpose test equipment

. Power supplies, voltmeters, pulse generators, and other basic test equipment that

is required for testing is general purpose test equipment. This equipment must be capable of meeting the test requirements

and should be periodically calibrated in accordance with ANSI/NCSL Z540-1 or equivalent.

3. PROCEDURE

. An outline of the procedure is as follows: a) determine the state vectors (or sequence of test vectors

for a dynamic test) in which the device will be irradiated; b) following the test plan, set up the test fixture, functional test

equipment, and transient measurement equipment; c) set up and calibrate the radiation source; d) perform a noise check on

the instrumentation; and e) test devices at a sequence of radiation pulses, determining the transient response at specified

dose rates. The dose rate upset level can be determined by measuring the transient response at several dose rates, using

successive approximation to determine the radiation level for dose rate upset.

3.1 State vector selection

. Two approaches can be used to select the state vectors in which a device is to be irradiated:

a. Multiple output logic states. Partition the circuit into functional blocks. Determine the logic path for each output,

and identify similar internal functions. For example, a 4-bit counter can be separated into control, internal flip-flop,

and output logic cells. Four identical logic paths exist, corresponding to each of the four bits. Determine the total

number of unique output logic state combinations, and test the circuit in each of these states. For the counter

example this results in 16 combinations so that the upset must be determined for each of these 16 state vectors.

MIL-STD-883F

METHOD 1021.2

15 November 1991

b. Topological analysis approach. If a photomicrograph of the circuit is available, the number of required states can

be reduced by examining the topology of the internal circuits. This allows one to eliminate the need to test paths

with the same output state which have identical internal geometries. For the counter, this reduces the required

number of states to two. This approach is recommended for more complex circuits where the multiple output logic

approach results in too many required state vectors.

3.2 Transient output upset criteria

. The transients that are permitted at logic outputs depend on the way that the system

application allocates the noise margin of digital devices. Most systems use worst-case design criteria which are not directly

applicable to sample testing because the samples represent typical, not worst-case parts, and have higher noise margins.

For example, although the logic swing of TTL logic devices is typically greater than 2 volts, the worst-case noise margin is

specified at 400 mV. In a typical system, much of this noise margin will be required for aberrations and electrical noise,

leaving only part of it, 100 mV to 200 mV, for radiation-induced transients. Thus, the allowable voltage transient is far lower

than the typical logic signal range. Loading conditions also have a large effect on output transients.

However, transient upset testing is usually done at a fixed temperature under conditions that are more typical than they are

worst-case. Thus, the noise margin during testing is much greater. The recommended default condition if not specified by

the system is a transient voltage exceeding 1 V for CMOS or TTL logic devices with 5 V (nominal) power supply voltage, and

30 percent of the room-temperature logic level swing for other technologies such as ECL, open collector devices, or

applications with other power supply voltages. Default loading conditions are minimum supply voltage and maximum fanout

(maximum loading).

The time duration of transient upset signals is also important. If the duration of the transient voltage change is less than the

minimum value required for other circuits to respond to it, the transient signal shall not be considered an upset. The

minimum time duration shall be one-half the minimum propagation delay time of basic gate circuits from the circuit

technology that is being tested.

Testing criteria may also be established for other parameters, such as the power supply current surge. Output current is

also important for tri-state or uncommitted ("open-collector") circuits. These criteria must be specified by the test plan, and

are normally based on particular system requirements.

3.3 Test plan

. The test plan must include the following:

a. Criteria for transient voltage upset, output current, and power supply current, as applicable.

b. Power supply and operating frequency requirements.

c. Loading conditions at the outputs.

d. Input voltage conditions and source impedance.

e. Functional test approach, including dynamic upset, if applicable.

f. Radiation pulse width(s).

g. Sequence used to adjust the dose rate in order to determine the upset threshold by successive approximation.

h. State vectors used for testing (determined from 3.1).

i. Radiation levels to be used for transient response measurements, if applicable.

j. A recommended radiation level at which to begin the test sequence for transient upset measurements, if

applicable.

k. The temperature of the devices during testing (usually 25°C ±5°C).

MIL-STD-883F

METHOD 1021.2

15 November 1991

3.4 Test circuit preparation

. The test circuit shall be assembled including a test circuit board, line drivers, electrical

instruments, functional test equipment, transient measurement equipment, and cables to provide the required input biasing,

output monitoring, and loading.

3.5 Facility preparation

. The radiation source shall be adjusted to operate in the specified mode and provide a radiation

pulse width within the specified width range. The required dosimeters shall be installed as close as practical to the device

under test. If special equipment is needed to control the temperature to the value specified in the test plan, this equipment

must be assembled and adjusted to meet this requirement.

3.6 Safety requirements

. The health and safety requirements established by the local Radiation Safety Officer or Health

Physicist shall be observed.

3.7 Test circuit noise check

. With all circuitry connected, a noise check shall be made. This may be done by inserting a

resistor circuit in place of the test device. Resistor values chosen shall approximate the active resistance of the device

under test. A typical radiation pulse shall be applied while the specified outputs are monitored. If any of the measured

transient voltages are greater than 10 percent of the expected parameter response, the test circuit is unacceptable and shall

not be used without modification to reduce noise.

3.8 Bias and load conditions

. Unless otherwise specified, the power supply shall be at the minimum allowed value. Input

bias levels shall be at worst-case logic levels. Outputs shall be loaded with the maximum load conditions in both logic states

(usually equivalent to maximum circuit fanout).

3.9 Temperature

. The temperature of the devices during test should be measured with an accuracy of ±5°C unless

higher accuracy is required in the test plan.

3.10 Procedure for dose rate upset testing

. The device to be tested shall be placed in the test socket. The required

pulse sequence shall be applied so that the device is in the state specified by the first of the state vectors in 3.1.

a. Set the intensity of the radiation source to the first radiation test level specified in the test plan. Expose the device

to a pulse of radiation, and measure the transient output responses and power supply current transient. For

sequential logic circuits, perform a dynamic functional test to see if changes occurred in internal logic states.

b. Repeat 3.10a for all other state vectors and radiation levels specified in the test plan.

3.11 Radiation exposure and test sequence for upset threshold testing

. The device to be tested shall be placed in the

test socket. The required pulse sequence shall be applied so that the device is in the state specified by the first of the state

vectors determined in 3.1, or is operating with the specified test vector sequence for dynamic upset.

a. Set the intensity of the radiation source to the initial level recommended in the test plan, and expose the device to

a pulse of radiation. Determine whether a stored data upset, logic state upset, or dynamic upset occurs, as

appropriate.

b. If no upset occurred, increase the radiation level according to the sequence specified in the test plan; if an upset

is observed decrease the radiation level. After the radiation source is adjusted to the new intensity, reinitialize the

part to the required state vector, expose it to an additional pulse, and determine whether or not upset occurred.

Continue this sequence until the upset response threshold level is bracketed with the resolution required in the

test plan.

c. The power supply peak transient current shall be monitored and recorded during radiation testing unless it is not

required by the test plan.

d. Repeat test sequences 3.11a through 3.11c for all of the state vectors.