MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第168页

MIL-STD-883F METHOD 1031 25 August 1983 4 This page i ntenti onally lef t blank

MIL-STD-883F

METHOD 1031

25 August 1983

FIGURE 1031-1. Graphical representation of corrosion test

MIL-STD-883F

METHOD 1031

25 August 1983

This page intentionally left blank

MIL-STD-883F

METHOD 1032.1

29 May 1987

METHOD 1032.1

PACKAGE INDUCED SOFT ERROR TEST PROCEDURE

(DUE TO ALPHA PARTICLES)

1. PURPOSE

. This test method defines the procedure for testing integrated circuits under known test conditions for

susceptibility to alpha induced errors. This test was specifically designed to measure the device's ability to withstand alpha

particle impact. In addition, the procedure will determine the effectiveness of a "die-coating" shield. The test objective is to

determine the rate that failures are induced due to alpha radiation sourced from the device package, die and die-coat

material.

1.1 Definitions

. The following definitions were created to be specific and relevant within the confines of this method.

1.1.1 DUT

. Device under test.

1.1.2 Soft error

. Any error induced by alpha particle impact resulting in either a transient error or an error in data storage

witnessed at the DUT's output.

1.1.3 Source

. A foil of Thorium-232. (Note: This foil generates particles which have an alpha energy spectrum of 0

through 10 MeV).

1.1.4 Soft error rate (SER)

. Failures per unit time under normal conditions of package environment.

1.1.5 Accelerated soft error rate (ASER)

. Failures per unit time induced by exposure to a known alpha particle source.

1.1.6 Failure in time (FIT)

. 1 FIT = 1 failure in 10

device-hours.

1.1.7 Package flux

. The total number of alpha particles impinging on the die surface per unit of time and area, due to

package material impurities (i.e., lid, die material, sealants, and optional alpha barrier material). Normal units of

measurement: alpha/cm

-hr.

1.1.8 Modified package flux

. The total number of alpha particles impinging on the die surface per unit of time and area,

when a die coat is in place. Normal units of measurement: alpha/cm

-hr.

1.1.9 Source flux

. The total number of alpha particles impinging on the die surface per unit of time and area, due to the

calibrated source. Normal units of measurement: alpha/cm

-s.

2. APPARATUS

. The apparatus will consist of electrical test instrumentation, test circuit board(s), cabling, interconnect

boards, or switching systems and a Thorium-232 foil (optional). Precautions will be observed to obtain an electrical

measurement system with adequate shielding, low electrical noise induction, and proper grounding.

2.1 Radiation source

. The radiation source used in this test shall be a Thorium-232 foil with dimensions large enough to

cover the entire exposed die cavity. The plated source shall be within the range of 0.01 - 5.0 µCi and shall produce the

same energy spectrum as the package impurities. Radiation sources must be controlled according to state and federal

regulations. The sources shall be certified periodically and decay rates used to determine the actual flux values at the time

of use. This source must be processed at least one year before being used. Caution: These sources should not be

exposed to heat.

2.2 Electrical test instruments

. Electrical test instruments will be standard test instruments normally used for testing the

DUT. They must be capable of establishing the required test conditions and measuring the required electrical parameters.

All instruments shall be periodically calibrated in accordance with the general requirements of this test method standard.