MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第186页
MIL-STD-883F METHOD 2003.8 18 June 2004 2 This page i ntenti onally lef t blank .
MIL-STD-883F
METHOD 2003.8
18 June 2004
1
METHOD 2003.8
SOLDERABILITY
1. Purpose. The purpose of this test method is to provide a referee condition for the evaluation of the solderability of
terminations (including leads up to 0.125 inch in diameter) that will be assembled using tin lead eutectic solder. This
evaluation is made on the basis of the ability of these terminations to be wetted and to produce a suitable fillet when coated
by tin lead eutectic solder. These procedures will test whether the packaging materials and processes used during the
manufacturing operations process produce a component that can be successfully soldered to the next level assembly using
tin lead eutectic solder. A preconditioning test is included in this test method, which degrades the termination finish to
provide a guard band against marginal finishes.
2. Procedure. The solderability test shall be performed in accordance with ICP/EIA J-STD-002 (current revision)
“Solderability Tests for Component Leads, Terminations, Lugs Terminals and Wires”, and herein. The following details and
exceptions shall apply:
2.1. Contractual Agreement. The contractual agreements statement in J-STD-002 shall not apply. Any exceptions to
the requirements specified in J-STD-002 current revision and this test method shall be documented in the individual military
procurement document or approved by the procuring military activity.
2.2. Coating Durability. The coating durability category (from J-STD-002 current revision) shall be as follows:
a. Category 2 – All non-tin component finishes, excluding gold (1 hr steam preconditioning).
b. Category 3 – For all other component finishes, including gold (8 hours +
15 minutes steam preconditioning).
2.3. Test Method. The test method from J-STD-002 (current revision shall be used as follows):
Test A – For through hole mount and surface mount leaded components, solid wire less than 0.045 inch diameter
and stranded wire 18 AWG or smaller. If not otherwise specified in the procurement document, angle of
immersion for surface mount leaded components shall be 90 degrees.
Test B – For surface mount leadless components.
Test C – For lugs, tabs, terminals, solid wires greater than 0.045-inch diameter, and stranded wires greater than
189 AWG.
3. Summary. The following details shall be specified in the applicable procurement document:
a. Depth of immersion if other than specified.
b. Angle of immersion for surface mount leaded components, if other than 90 degrees.
c. Measurements after test, where applicable.
*
*
*
*
*
*
*
MIL-STD-883F
METHOD 2003.8
18 June 2004
2
This page intentionally left blank.
MIL-STD-883F
METHOD 2004.5
29 November 1985
1
METHOD 2004.5
LEAD INTEGRITY
1. PURPOSE
. This method provides various tests for determining the integrity of microelectronic device leads
(terminals), welds, and seals. Test condition A provides for straight tensile loading. Test condition B
1
provides for
application of bending stresses to determine integrity of leads, seals, and lead plating while B
2
employs multiple application
of bending stresses primarily to determine the resistance of the leads to metal fatigue under repeated bending. Test
conditions C
1
and C
2
provide for application of torque or twisting stresses to device leads or studs, respectively, to
determine integrity of leads and seals. Test condition D provides for application of peel and tensile stresses to determine
integrity of terminal adhesion and plating of leadless packages. It is recommended that this test be followed by a seal test in
accordance with method 1014 to determine any effect of the stresses applied on the seal as well as on the leads (terminals).
2. APPARATUS
. See applicable test condition.
3. GENERAL PROCEDURE APPLICABLE TO ALL TEST CONDITIONS
. The device shall be subjected to the stresses
described in the specified test condition and the specified end-point measurements and inspections shall be made except for
initial conditioning or unless otherwise specified. Unless otherwise specified, the Sample Size Series sampling shall apply
to the leads, terminals, studs or pads chosen from a minimum of 3 devices.
4. SUMMARY
. The following details and those required by the specific test condition shall be specified in the applicable
acquisition document:
a. Test condition letter.
b. Number and selection of leads (terminals), if different from above.
TEST CONDITION A - TENSION
1. PURPOSE
. This test is designed to check the capabilities of the device leads, welds, and seals to withstand a straight
pull.
2. APPARATUS
. The tension test requires suitable clamps and fixtures for securing the device and attaching the
specified weight without lead restriction. Equivalent linear pull test equipment may be used.
3. PROCEDURE
. A tension of 0.227 kg (8 ounces), unless otherwise specified, shall be applied, without shock, to each
lead or terminal to be tested in a direction parallel to the axis of the lead or terminal and maintained for 30 seconds
minimum. The tension shall be applied as close to the end of the lead (terminal) as practicable.
3.1 Failure criteria
. When examined using 10X magnification after removal of the stress, any evidence of breakage,
loosening, or relative motion between the lead (terminal) and the device body shall be considered a failure. When a seal
test in accordance with method 1014 is conducted as a post test measurement following the lead integrity test(s), meniscus
cracks shall not be cause for rejection of devices which pass the seal test.
4. SUMMARY
. The following details shall be specified in the applicable acquisition document:
a. Weight to be attached to lead, if other than .227 kg (8 ounces) (see 3).
b. Length of time weight is to be attached, if other than 30 seconds (see 3).
TEST CONDITION B
1
- BENDING STRESS
1. PURPOSE
. This test is designed to check the capability of the leads, lead finish, lead welds, and seals of the devices
to withstand stresses to the leads and seals which might reasonably be expected to occur from actual handling and
assembly of the devices in application, or to precondition the leads with a moderate bending stress prior to environmental
testing.
2. APPARATUS
. Attaching devices, clamps, supports, or other suitable hardware necessary to apply the bending stress
through the specified bend angle.