MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第193页

MIL-STD-883F METHOD 2004.5 29 November 1985 7 MATE RIALS Flux: Flux type symbol “A” or “B” ( flux type “L0” or “L1” ) in acc ordance wi th ANSI/J -STD- 004 (previous ly designat ed as Type R or RMA onl y, in ac cordanc e…

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MIL-STD-883F
METHOD 2004.5
29 November 1985
6
FIGURE 2004-1 Angle of bend for dual-in-line package configurations
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MIL-STD-883F
METHOD 2004.5
29 November 1985
7
MATERIALS
Flux: Flux type symbol “A” or “B” (flux type “L0” or “L1”)
in accordance with ANSI/J-STD-004 (previously
designated as Type R or RMA only, in accordance
with MIL-F-14256).
Solder: Sn60A or Pb40A or Sn63A or Pb37A in accordance
with ANSI/J-STD-006 (previously designated as
Sn 60 or Sn 63 in accordance with QQ-S-571).
Wire: Soft annealed solid copper.
FIGURE 2004-2 Solder pad adhesion
.
MIL-STD-883F
METHOD 2004.5
29 November 1985
8
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