MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第2页
MIL-STD-883F ii FOREW ORD 1. This standar d is appr oved for us e by all Depar tments and Agencies of the Depar tment of Defens e. 2. Comment, suggest ions, or quest ions on t his doc ument shoul d be address ed to: Comm…
MIL-STD-883F
18 JUNE 2004
SUPERSEDING
MIL-STD-883E
31 DECEMBER 1996
DEPARTMENT OF DEFENSE
TEST METHOD STANDARD
MICROCIRCUITS
AMSC N/A FSC 5962
The documentation and process
conversion measures necessary to
comply with this revision shall be
completed by 31 December 2004.
INCH - POUND
MIL-STD-883F
ii
FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense.
2. Comment, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center
Columbus ATTN: DSCC-VA, P.O. Box 3990, Columbus, OH 43218-3990, or by email to STD883@dscc.dla.mil
. Since
contact information can change, you may want to verify the currency of this address information using the ASSIST Online
database at: http://www.dodssp.daps.mil.
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MIL-STD-883F
iii
CONTENTS
PARAGRAPH Page
1. SCOPE...................................................................................................................................... 1
1.1 Purpose................................................................................................................................... 1
1.2 Intended use of or reference to MIL-STD-883.......................................................................... 1
2. APPLICABLE DOCUMENTS..................................................................................................... 3
2.1 General.................................................................................................................................... 3
2.2 Government documents........................................................................................................... 3
2.3 Non-Government publications.................................................................................................. 4
2.4 Order of precedence................................................................................................................ 5
3. ABBREVIATIONS, SYMBOLS, AND DEFINITIONS.................................................................. 6
3.1 Abbreviations, symbols, and definitions................................................................................... 6
4. GENERAL REQUIREMENTS.................................................................................................... 8
4.1 Numbering system................................................................................................................... 8
4.2 Test results.............................................................................................................................. 9
4.3 Test sample disposition........................................................................................................... 9
4.4 Orientation............................................................................................................................... 9
4.5 Test conditions ........................................................................................................................12
4.6 General precautions ................................................................................................................14
5. DETAIL REQUIREMENTS ........................................................................................................15
6. NOTES......................................................................................................................................16
FIGURES
FIGURE
1. Orientation of noncylindrical microelectronic devices to
direction of applied force............................................................................................................10
2. Orientation of cylindrical microelectronic device to
direction of applied force............................................................................................................11
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