MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第202页

MIL-STD-883F METHOD 2008.1 31 August 1977 2 This page i ntenti onally lef t blank

MIL-STD-883F

METHOD 2008.1

31 August 1977

METHOD 2008.1

VISUAL AND MECHANICAL

Method 2008 is canceled effective 15 November 1974. It is superseded by methods 2014, 2015, and 2016. Test

condition A of method 2008 is superseded by method 2016. Test condition B, except for 3.2.1 (Marking), is superseded by

method 2014. Paragraph 3.2.1 is superseded by method 2015.

MIL-STD-883F

METHOD 2008.1

31 August 1977

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MIL-STD-883F

METHOD 2009.9

19 August 1994

METHOD 2009.9

EXTERNAL VISUAL

1. PURPOSE

. The purpose of this test method is to verify the workmanship of hermetically packaged devices. This test

method shall also be utilized to inspect for damage due to handling, assembly, and/or test of the packaged device. This

examination is normally employed at outgoing inspection within the device manufacturer's facility, or as an incoming

inspection of the assembled device.

2. APPARATUS

. Equipment used in this test shall be capable of demonstrating device conformance to the applicable

requirements. Equipment shall include optical devices capable of magnification of at least 1.5X to 10X, with a relatively

large and accessible field of view.

3. PROCEDURE

3.1 Magnification

. Devices shall be examined at 1.5X to 10X magnification. Devices may be examined anywhere in the

range of 1.5X to 10X, however, acceptable product must be capable of passing all criteria when examined at 10X

magnification. Individual glass seals (see 3.3.8) shall be examined at 7X to 10X magnification.

3.2 Foreign material

. When foreign material is present, and its adherence is in question, the device may be subjected to

a clean filtered gas stream (vacuum or expulsion) of approximately 20 psig.

3.3 Failure criteria

. Devices shall fail if they exhibit any of the following:

3.3.1 General

a. Illegible marking, or marking content or placement not in accordance with the applicable specification.

b. Presence of any secondary coating material that visually obscures a seal area(s) (i.e., any hermetic interface).

c. Evidence of any nonconformance with the detail drawing or applicable procurement document, or absence of any

required feature.

3.3.2 Foreign/displaced material

a. Braze material flow, or other foreign material (i.e., contamination or corrosion) that reduces the isolation between

leads or between braze pads to less than 50% of the lead separation (pad separation for brazed leads) but in no

case less than the case outline minimum.

b. Leads or terminals that are not free of foreign material such as paint or other adherent deposits.

3.3.3 Construction defects

a. Protrusions on the bottom (mounting) surface of the package that extend beyond the seating plane.

b. Protrusions (excluding glass run-out) on any other package surface that exceed the lead thickness in height

(leaded packages).

c. Protrusions on the lid or cover, or extending beyond the surface plane of solder pads, that exceed 25% of the

terminal width in height (leadless packages).

d. Metallization not intended by design between solder pads, between elements of thermal patterns and/or between

seal ring or lid to metallized castellations that reduce the isolation to less than 50% of pad separation (leadless

packages).