MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第203页

MIL-STD-883F METHOD 2009.9 19 August 1994 1 METHOD 2009.9 EXTERNAL VISUAL 1. PURPOSE . The purpos e of thi s tes t method i s to ver ify the wor kmans hip of hermet ical ly pack aged devices . This tes t method shal l al…

MIL-STD-883F

METHOD 2008.1

31 August 1977

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MIL-STD-883F

METHOD 2009.9

19 August 1994

METHOD 2009.9

EXTERNAL VISUAL

1. PURPOSE

. The purpose of this test method is to verify the workmanship of hermetically packaged devices. This test

method shall also be utilized to inspect for damage due to handling, assembly, and/or test of the packaged device. This

examination is normally employed at outgoing inspection within the device manufacturer's facility, or as an incoming

inspection of the assembled device.

2. APPARATUS

. Equipment used in this test shall be capable of demonstrating device conformance to the applicable

requirements. Equipment shall include optical devices capable of magnification of at least 1.5X to 10X, with a relatively

large and accessible field of view.

3. PROCEDURE

3.1 Magnification

. Devices shall be examined at 1.5X to 10X magnification. Devices may be examined anywhere in the

range of 1.5X to 10X, however, acceptable product must be capable of passing all criteria when examined at 10X

magnification. Individual glass seals (see 3.3.8) shall be examined at 7X to 10X magnification.

3.2 Foreign material

. When foreign material is present, and its adherence is in question, the device may be subjected to

a clean filtered gas stream (vacuum or expulsion) of approximately 20 psig.

3.3 Failure criteria

. Devices shall fail if they exhibit any of the following:

3.3.1 General

a. Illegible marking, or marking content or placement not in accordance with the applicable specification.

b. Presence of any secondary coating material that visually obscures a seal area(s) (i.e., any hermetic interface).

c. Evidence of any nonconformance with the detail drawing or applicable procurement document, or absence of any

required feature.

3.3.2 Foreign/displaced material

a. Braze material flow, or other foreign material (i.e., contamination or corrosion) that reduces the isolation between

leads or between braze pads to less than 50% of the lead separation (pad separation for brazed leads) but in no

case less than the case outline minimum.

b. Leads or terminals that are not free of foreign material such as paint or other adherent deposits.

3.3.3 Construction defects

a. Protrusions on the bottom (mounting) surface of the package that extend beyond the seating plane.

b. Protrusions (excluding glass run-out) on any other package surface that exceed the lead thickness in height

(leaded packages).

c. Protrusions on the lid or cover, or extending beyond the surface plane of solder pads, that exceed 25% of the

terminal width in height (leadless packages).

d. Metallization not intended by design between solder pads, between elements of thermal patterns and/or between

seal ring or lid to metallized castellations that reduce the isolation to less than 50% of pad separation (leadless

packages).

MIL-STD-883F

METHOD 2009.9

19 August 1994

3.3.4 Package Body/Lid Finish

a. Defective finish (peeling, flaking, pitting, blistering, or corrosion). Discoloration that does not exhibit these

conditions is acceptable.

b. Scratches, mars, or indentations, either due to damage or processing, that expose base metal. Exposed

underplate is acceptable.

3.3.5 Leads

a. Broken leads.

b. Leads or terminals that are not intact or aligned in their normal location, free of sharp or unspecified lead bends, or

twisted more than 20° from the normal lead plane.

c. Leads with pits and/or depressions that exceed 25% of the width (diameter for round leads) and are greater than

50% of the lead thickness in depth.

d. Leads with burrs exceeding a height greater than 50% of the lead thickness.

e. Lead misalignment to the braze pad to the extent that less than 75% of the lead braze section is brazed to the pad.

f. Metallization (including solder lead finish) in which the isolation between leads or between lead and other package

metallization is reduced to less than 50% of lead separation (pad separation for brazed leads) but in no case less

than the case outline minimum.

g. Braze material that increases the lead dimensions to greater than 1.5 times the lead thickness above the design

maximum between the seating plane and the ceramic body or that increases the lead dimensions to greater than

the design maximum below the seating plane.

h. Scratches that expose base metal over more than 5% of the lead surface area. Exposed base metal on the cut

lead ends is acceptable and does not count in the 5%.

3.3.6 Package body/lid - leaded devices

a. Broken packages or cracks in the packages. Surface scratches shall not be cause for failure except where they

violate other criteria stated herein for marking, finish, etc.

b. Any chipout dimension that exceeds 0.060 inch in any direction on the surface and has a depth that exceeds 25%

of the thickness of the affected package element (e.g., cover, base, or wall).

c. External lead metallization stripe forming a conductor to a brazed lead that exhibits voids greater than 25% of the

conductor width.

d. Evidence of cracks, delamination, separation, or voiding on any multilayer ceramic package.

3.3.7 Package body/lid - leadless devices

a. Ceramic chip-outs that dimensionally exceed 50% of the distance between terminals in any direction on the

affected surface (edge or corner), and exceed a depth of 25% of the thickness of the affected package element

(e.g., cover, lid, base, or wall).

b. Evidence of cracks, delamination, separation, or voiding on any package element.

c. Castellation to solder pad misalignment. The metal in the castellation, exclusive of the angular ring, shall be within

the visually extended boundaries of the solder pad (see figure 2009-1).