MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第21页

MIL-STD-883F 15 5. DET AILED R EQUIREM ENTS This s ecti on is not applic able to t his s tandard.

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MIL-STD-883F
14
4.5.9.2 Temperature control during testing for T
C
, T
A
, or T
J
below 25°C. Unless otherwise specified, the device (including
its internal elements; e.g., die, capacitors, resistors, etc.) shall reach temperature and be stabilized in the power-off
condition to within +
3 °C (or –6 +3 °C for hybrids) of the specified temperature (see note below). Note: Hybrids may exceed
the negative tolerance of -6 °C if their construction dictates and providing the manufacturer can assure that the devices
under test are not degraded. When an established temperature characterization profile is available for a device to be tested,
this profile may be used in lieu of temperature measurements to determine the proper heat soak conditions for meeting this
requirement. When using a temperature characterization profile, test apparatus monitoring will assure that the controls are
providing the proper test environment for that profile. After stabilization, (this temperature shall be identified as the cold-start
temperature) testing shall be performed and the T
C
, T
A
, or T
J
controlled to not exceed +5 °C of the specified temperature
throughout the test duration. The electrical test parameters shall be measured using low duty cycle pulse testing or, if
specified, power stable conditions (see 4.5.9.4). When applicable, the detail specification shall specify those parameters or
sequence of tests most sensitive to the cold-start temperature. These parameters, when specified, shall be measured at the
start of the test sequence and shall be completed as soon as possible or within a specified time.
NOTE: Unless otherwise specified in the applicable detail specification, the set temperature shall be -55°C (T
C
, T
A
, or T
J
,
as applicable) or colder if the device temperature (T
C
, T
A
, or T
J
, as applicable) increases by more than +5°C during
the test duration.
4.5.9.3 Temperature control during testing for T
C
, T
A
, or T
J
at 25°C. Unless otherwise specified, the device (including its
internal elements; e.g., die, capacitors, resistors, etc.) shall be stabilized in the power-off condition until the temperature is
25°C +3°C, -5°C. The electrical test parameters shall be measured using low duty pulse testing or, if specified, power stable
conditions (see 4.5.9.4).
4.5.9.4 Power stable temperature condition
. When specified, the device shall be stabilized in the specified steady-state
power-on condition at the specified test temperature, T
A
, T
C
, or T
J
as applicable, for temperatures at, above, or below 25°C
for a minimum time period of 5 minutes or a specified time. The electrical parameters measurements shall be completed as
soon as possible or within a specified period of time after temperature/power stabilization has occurred. Alternatively, when
specified, the device temperature T
C
or T
A
may be stabilized within ±3°C of the junction temperature typically predicted for
the specified steady-state power-on condition of 5 minutes or more and the testing conducted with low duty pulse
techniques.
4.6 General precautions
. The following precautions shall be observed in the testing of devices:
4.6.1 Transients
. Devices shall not be subjected to conditions in which voltage or current transients cause the ratings to
be exceeded.
4.6.2 Order of connection of leads
. Care should be taken when connecting a microelectronic device to a power source.
For MOS devices or other microelectronic circuits or devices where the order of connection of leads may be important,
precautions cited in the applicable acquisition document shall be observed.
4.6.3 Soldering and welding
. Adequate precautions shall be taken to avoid damage to the device during soldering or
welding required for tests.
4.6.4 Radiation precautions
. Due precautions shall be used in storing or testing microelectronic devices in substantial
fields of x-rays, neutrons, or other energy particles.
4.6.5 Handling precautions for microelectronic devices
.
a. Ground all equipment prior to insertion of the device for electrical test.
b. Where applicable, keep devices in metal shields until they are inserted in the equipment or until necessary to
remove for test.
c. Where applicable, keep devices in carriers or other protective packages during test.
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MIL-STD-883F
15
5. DETAILED REQUIREMENTS
This section is not applicable to this standard.
MIL-STD-883F
16
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 The intended use of this standard is to establish appropriate conditions for testing microcircuit devices to give test
results that simulate the actual service conditions existing in the field. This standard has been prepared to provide uniform
methods, controls, and procedures for determining with predictability the suitability of such devices within Military,
Aerospace and special application equipment. This standard is applicable only to microelectronic devices, i.e. monolithic,
multi-chip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed.
6.2 Chemical listing
. The following is a listing of chemicals identified for use in MIL-STD-883 test methods:
Material
CAS listing Test method
Acetic Acid 64-19-7 2021
3.5-Dimethyl-1-hexyn-3-o1 4209-91-0 1002
Ethylbenzene 100-41-4 2015
Fluorescein 2321-07-5 1014
Freon-113 1
/ 76-13-1 2015,1014
Hydrochloric Acid 7647-01-0 1009
Isopropyl Alcohol 67-63-0 2015,2003
Kerosene 8008-20-6 2015
Morpholine 110-91-8 1002
Methanol 67-56-1 1002
Methylene Chloride 1
/ 75-09-2 2015
Mineral Spirits 8032-32-4 2015
Monoethanolamine 141-43-5 2015
Nitric Acid 7697-37-2 2021
Phosphoric Acid 7664-38-2 2021
Propylene Glycol Monomethyl Ether 107-98-2 2015
Rhodamine B 81-88-9 1014
Sodium Chloride 7647-14-5 1009,1002
Sodium Hydroxide 1310-73-2 1009
Stannous Chloride 7772-99-8 1002
1,1,1-Trichloroethane 1
/ 71-55-6 2015
Zyglo Dye 8002-05-9 1014
In the event of a chemical emergency (example: spill, leak, fire, or exposure) obtain additional help or information by calling
the telephone number listed below and identify the chemical by the CAS number provided above.
Chem Trec: 1-800-424-9300
6.3 Subject term (key word) listing
.
Intended use
Provisions for the use of MIL-STD-883
Abbreviations
Classification of tests
Orientation
Electrical test equipment accuracy
Test environment
General precautions
Chemical listing
1
/ These chemicals are no longer required to be used in MIL-STD-883 test methods.
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