MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第256页
MIL-STD-883F METHOD 2010.11 18 June 2004 46 Condition A Conditi on B Class le vel S Class lev el B e. Ef fect ive bonded area l ess t han 50 percent of that which woul d be possi ble for an exactly al igned beam (s ee fi…
MIL-STD-883F
METHOD 2010.11
18 June 2004
45
Condition A Condition B
Class level S Class level B
3.2.3.2 Die mounting noneutectic
. No device shall be acceptable that exhibits:
a. Adhesive material immediately adjacent to the die that extends onto or vertically above the top surface of the die.
b. Adhesive fillet not visible along 75 percent of each side of the die.
c. Any flaking, peeling, or lifting of the adhesive material.
d. Separation, cracks, or fissures greater than or equal to 2 mils in width in the adhesive at the cavity wall or cavity
floor.
e. Crazing in the adhesive.
f. Adhesive material on the top surface of the die.
g. Adhesive that bridges package posts or is on the post bond area.
h. Any adhesive material that is connected to the fillet or conductive cavity (e.g. metal package base or metallized
floor of ceramic package), and extends up the cavity wall to within 1.0 mil of the package post.
i. Transparent die with less than 50 percent of the area bonded.
3.2.3.3 Die orientation
. No device shall be acceptable that exhibits:
a. Die not located or oriented in accordance with the applicable assembly drawing.
b. Die that appears to be obviously tilted (i.e., more than 10 degrees) with respect to the package cavity.
3.2.4 Beam lead construction
.
3.2.4.1 Bonds
. This inspection criteria shall apply to the completed bond area made, using either direct tool contact or a
compliant intermediate layer. No device shall be acceptable that exhibits:
a. Bonds where the tool impression does not completely cross the entire beam width.
b. Bonds on thin film substrate metal where the tool impression increases the beam lead width less than 15 percent
(10 percent for compliant bonds) or greater than 75 percent of the undeformed beam width.
c. Bonds where the tool impression length is less than 1.0 mil (see figure 2010-37).
d. Bonding tool impression less than 1.0 mil from the die edge (see figure 2010-37).
MIL-STD-883F
METHOD 2010.11
18 June 2004
46
Condition A Condition B
Class level S Class level B
e. Effective bonded area less than 50 percent of that which would be possible for an exactly aligned beam (see
figure 2010-37).
FIGURE 2010-37. Beam lead bond area and location
.
MIL-STD-883F
METHOD 2010.11
18 June 2004
47
Condition A Condition B
Class level S Class level B
f. Cracks or tears in the effective bonded area of the beam greater than 50 percent of the original beam width.
g. Bonds placed so that the separation between bonds and between bonds and operating metallization not
connected to them is less than 0.1 mil.
h. Bonds lifting or peeling.
3.2.4.2 Beam leads
. No device shall be acceptable that exhibits the following:
a. Voids, nicks, depressions, or scratches that leave less than 50 percent of the beam width undisturbed.
b. Beam separation from the die.
c. Missing or partially fabricated beam leads unless by design.
d. Beam leads that are not bonded.
e. Bonded area closer than 0.1 mil to the edge of the passivation layer.
f. Less than 0.1 mil passivation layer between the die and the beam visible at both edges of the beam (see figure
2010-37 and 2010-38).