MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第265页

MIL-STD-883F METHOD 2011.7 22 March 1989 5 NOTE: The minimum bond s trengt h should be t aken fr om table I . Figure 2011- 1 may be us ed for wi re diamet ers not speci fied i n table I. FIGURE 2011-1. Mi nimum bond pull…

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MIL-STD-883F
METHOD 2011.7
22 March 1989
4
TABLE I. Minimum bond strength.
Test
condition
Wire
composition
and diameter
1
/
Construction
2
/
Minimum bond strength (grams force)
Pre seal Post seal and any other
processing and screening
when applicable
A --- --- Given in
applicable
document
Given in applicable
document
C or D AL 0.0007 in
AU 0.0007 in
Wire 1.5
2.0
1.0
1.5
C or D AL 0.0010 in
AU 0.0010 in
Wire 2.5
3.0
1.5
2.5
C or D AL 0.00125 in
AU 0.00125 in
Wire Same bond strength limits
as the 0.0013 in wire
C or D AL 0.0013 in
AU 0.0013 in
Wire 3.0
4.0
2.0
3.0
C or D AL 0.0015 in
AU 0.0015 in
Wire 4.0
5.0
2.5
4.0
C or D AL 0.0030 in
AU 0.0030 in
Wire 12.0
15.0
8.0
12.0
F Any Flip-clip 5 grams-force x
number of bonds (bumps)
G or H Any Beam lead 30 grams force in accordance with
linear millimeter of nominal undeformed
(before bonding) beam width. 3
/
1
/ For wire diameters not specified, use the curve of figure 2011-1 to determine the bond
pull limit.
2
/ For ribbon wire, use the equivalent round wire diameter which gives the same
cross-sectional area as the ribbon wire being tested.
3
/ For condition G or H, the bond strength shall be determined by dividing the breaking
force by the total of the nominal beam widths before bonding.
4. SUMMARY
. The following details shall be specified in the applicable acquisition document:
a. Test condition letter (see 3).
b. Minimum bond strength if other than specified in 3.2 or details of required strength distributions if applicable.
c. Sample size number and accept number or number and selection of bond pulls to be tested on each device, and
number of devices, if other than 4.
d. For test condition A, angle of bond peel if other than 90°, and bond strength limit (see 3.2).
e. Requirement for reporting of separation forces and failure categories, when applicable (see 3.2.1).
MIL-STD-883F
METHOD 2011.7
22 March 1989
5
NOTE: The minimum bond strength should be taken from table I. Figure 2011-1
may be used for wire diameters not specified in table I.
FIGURE 2011-1. Minimum bond pull limits
.
MIL-STD-883F
METHOD 2011.7
22 March 1989
6
FIGURE 2011-2. Wire loop angle
.
FIGURE 2011-3. Flat loop wire pull testing
.