MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第266页
MIL-STD-883F METHOD 2011.7 22 March 1989 6 FIGURE 2011-2. W ir e loop angle . FIGURE 2011-3. Flat loop wi re pull t esti ng .
MIL-STD-883F
METHOD 2011.7
22 March 1989
5
NOTE: The minimum bond strength should be taken from table I. Figure 2011-1
may be used for wire diameters not specified in table I.
FIGURE 2011-1. Minimum bond pull limits
.
MIL-STD-883F
METHOD 2011.7
22 March 1989
6
FIGURE 2011-2. Wire loop angle
.
FIGURE 2011-3. Flat loop wire pull testing
.
MIL-STD-883F
METHOD 2012.7
1 June 1993
1
METHOD 2012.7
RADIOGRAPHY
1. Purpose
. The purpose of this examination is to nondestructively detect defects within the sealed case, especially
those resulting from the sealing process and internal defects such as foreign objects, improper interconnecting wires,
and voids in the die attach material or in the glass when glass seals are used. It establishes methods, criteria, and
standards for radiographic examination of semiconductor and hybrid devices.
NOTE: For certain device types, opacity of the construction materials (packages or internal attachment) may
effectively prevent radiographic identification of certain types of defects from some or all possible viewing angles. This
factor should be considered in relation to the design of each device when application of this test method is specified.
2. Apparatus
. The apparatus and material for this test shall include:
a. Radiographic equipment with a sufficient voltage range to penetrate the device. The focal distance shall be
adequate to maintain a sharply defined image of an object with a major dimension of 0.0254 mm (0.001 inch).
b. Radiographic film: Very fine grain industrial X-ray film grade, either single or double emulsion.
c. Radiographic viewer: Capable of 0.0254 mm (0.001 inch) resolution in major dimension.
d. Holding fixtures: Capable of holding devices in the required positions without interfering with the accuracy or ease
of image interpretation.
e. Radiographic quality standards: Capable of verifying the ability to detect all specified defects.
f. Film holder: A 1.6 mm (0.0625 inch) minimum lead-topped table or lead-backed film holders to prevent back
scatter of radiation.
3. Procedure
. The X-ray exposure factors, voltage, milliampere and time settings shall be selected or adjusted as
necessary to obtain satisfactory exposures and achieve maximum image details within the sensitivity requirements for
the device or defect features the radiographic test is directed toward. The X-ray voltage shall be the lowest consistent
with these requirements and shall not exceed 200 kV.
3.1 Mounting and views
. The devices shall be mounted in the holding fixture so that the devices are not damaged or
contaminated and are in the proper plane as specified. The devices may be mounted in any type of fixture and masking
with lead diaphragms or barium clay may be employed to isolate multiple specimens provided the fixtures or masking
material do not block the view from X-ray source to the film of any portion of the body of the device.
3.1.1 Views
.
3.1.1.1 Flat packages, dual-in-line packages, hybrid packages, and single ended cylindrical devices
. Flat packages,
dual-in-line packages, hybrid packages, and single ended cylindrical devices, unless otherwise specified, shall have one
view taken with the X-rays penetrating in the Y direction as defined on figures 1 and 2 of MIL-STD-883, GENERAL
REQUIREMENTS. When more than one view is required, the second and third views, as applicable, shall be taken with
the X-rays penetrating in the Z and X direction respectively (either Z or X for flat packages). The die/cavity interface
shall be positioned as close as possible to the film to avoid distortion.