MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第271页

MIL-STD-883F METHOD 2012.7 1 June 1993 5 (f) Any evidence of the sus pect parti cle( s) havi ng moved or having dis appeared f rom their origi nal loc ation s hall c ause the devi ce to be r ejected. If t he parti cle( s…

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MIL-STD-883F
METHOD 2012.7
1 June 1993
4
3.10.2.1 Presence of extraneous matter
. Extraneous matter (foreign particles) shall include, but not be limited to:
a. Any foreign particle, loose or attached, greater than 0.025 mm (0.001 inch) (see figure 2012-1), or of any lesser
size which is sufficient to bridge nonconnected conducting elements of the semiconductor device.
b. Any wire tail extending beyond its normal end by more than two wire diameters at the semiconductor die pad or by
more than four wire diameters at the semiconductor package post (see figure 2012-1).
c. Any burr on a post (header lead) greater than 0.08 mm (0.003 inch) in its major dimension or of such configuration
that it may break away.
d. Excessive semiconductor element bonding material build-up.
(1) A semiconductor element shall be mounted and bonded so that it is not tilted more than 10° from the normal
mounting surface. The bonding agent that accumulates around the perimeter of the semiconductor element
whether or not it touches the side of the semiconductor element shall not accumulate to a thickness greater
than the height of the semiconductor element (see figures 2012-2 and 2012-3), or any lead or post, or be
separated from the main bonding material area (see 2012-7).
(2) There shall be no visible extraneous material 0.025 mm (0.001 inch) or larger in the major
dimension inside the semiconductor device. Loose bonding material will be considered
extraneous material. Excessive (but not loose) bonding material will not be considered
extraneous unless it fails to meet the requirements of 3.10.2.1.d.(1) or unless the accumulation of
bonding material is such that the height of the accumulation is greater than the width of its base
or that the accumulation necks down at any point (see figures 2012-2 and 2012-3).
NOTE: Devices with suspect foreign particles or extraneous material (in accordance with
3.10.2.1a and 3.10.2.1.d(2) may be verified as acceptable provided the following conditions are
met:
(a) A visual inspection of the die attach area at 30X to 60X shall have been conducted prior to die
attach sufficient to assure there are no anomalies in the die attach area which could interfere
with effective die attach.
(b) The precap inspection shall have been conducted 100 percent to condition A of method 2010
of MIL-STD-883 and the devices shall have been inspected and prepared for sealing in a class
100 environment.
(c) All devices with X-ray defects to other criteria of 3.10 shall have been removed from the lot.
(d) Serialized devices with less than 5 suspect foreign particles and extraneous material shall be
vibrated and shocked in accordance with PIND method 2020, condition A with the detector off.
(e) A second X-ray examination of the failed view of the serialized devices after the PIND
vibration/shock shall be conducted and each individual device shall be compared to its
previous X-ray record.
MIL-STD-883F
METHOD 2012.7
1 June 1993
5
(f) Any evidence of the suspect particle(s) having moved or having disappeared from their
original location shall cause the device to be rejected. If the particle(s) exhibit no evidence of
movement, the device may be accepted.
(g) The manufacturer doing the reinspection for suspect foreign particles or extraneous material
shall implement a process monitor visual inspection of the cavity of the reinspected devices to
assure that accepted devices do not have actual rejectable foreign particles or extraneous
material (see 3.2.3.1a, 3.2.3.1d, and 3.2.3.1e, 3.2.3.2a, 3.2.3.2c, 3.2.3.2f, 3.2.3.2g, 3.2.3.2h,
and 3.2.5 of method 2010). If any reinspected device fails the process monitor visual
inspection, then all reinspected devices in the lot that have been inspected are subject to
disposition. Corrective action, when appropriate, must be instituted. A procedure is required
for the traceability, recovery, and disposition of all reinspected units accepted since the last
successful monitor. The records for this monitor shall include identification of all lots which
are reinspected to this note, identification of those lots which are monitored by this visual
inspection, sample size, frequency of sampling, results of the visual inspections, and the
package types reinspected.
In the case of a failed monitor, the records must identify all lots affected, their final disposition
and a rationale for their disposition. Additionally, for a failed monitor, the records must also
contain a description of any instituted corrective action together with its rationale. Records of
this type shall be made available to the qualifying activity upon request.
e. Gold flaking on the header or posts or anywhere inside the case.
f. Extraneous ball bonds anywhere inside case, except for attached bond residue when rebonding is allowed.
3.10.2.2 Unacceptable construction
. In the examination of devices, the following aspects shall be considered
unacceptable construction and devices that exhibit any of the following defects shall be rejected.
a. Voids: When radiographing devices, certain types of mounting do not give true representations of voids. When
such devices are inspected, the mounting shall be noted on the inspection report (see figure 2012-1).
(1) Contact area voids in excess of one-half of the total contact area.
(2) A single void which traverses either the length or width of the semiconductor element and
exceeds 10 percent of the total intended contact area.
b. Wires present, other than those connecting specific areas of the semiconductor element to the external leads.
Device designs calling for the use of such wires including jumper wires necessary to trim load resistors are
acceptable (see figure 2012-1).
c. Cracks, splits, or chips of the electrical elements.
MIL-STD-883F
METHOD 2012.7
1 June 1993
6
d. Excessive undercutting of the electrical elements (X and Z plane only, see figure 2012-4).
e. Defective seal: Any device wherein the integral lid seal is not continuous or is reduced from its designed sealing
width by more than 75 percent. Expulsion resulting from the final sealing operation is not considered extraneous
material as long as it can be established that it is continuous, uniform and attached to the parent material and does
not exhibit a ball, splash or tear-drop configuration (i.e., where the base support least dimension is smaller than the
dimension it is supposed to support).
f. Inadequate clearance: Acceptable devices shall have adequate internal clearance to assure that the elements
cannot contact one another or the case. No crossover shall be allowed except as permitted by 3.2.2e of method
2010 (condition A). Depending upon the case type, devices shall be rejected for the following conditions:
NOTE: Any of the following criteria for bond wires shall not apply, if the wires are not visible In the X-ray.
(1) Flat pack and dual-in-line (see figure 2012-5).
(a) Any lead wire that appears to touch or cross another lead wire or bond, (Y plane only).
(b) Any lead wire that deviates from a straight line from bond to external lead and appears to be
within 0.05 mm (.002 inch) of another bond or lead wire (Y plane only).
(c) Lead wires that do not deviate from a straight line from bond to external lead and appear to
touch another wire or bond, excluding common wires, (Y plane only).
(d) Any lead wire that touches or comes within 0.05 mm (0.002 inch) of the case or external lead
to which it is not attached (X and Y plane).
(e) Any bond that is less than 0.025 mm (0.001 inch) (excluding bonds connected by a common
conductor) from another bond (Y plane only).
(f) Any wire making a straight line run from die bonding pad to package post that has no arc.
(g) Lead wires that sag below an imaginary plane across the top of the die bond (X plane only)
except by design.
(2) Round or "box" transistor type (see figure 2012-6).
(a) Any lead wire that touches or comes within 0.05 mm (0.002 inch) of the case or external lead
to which it is not attached (X and Y plane).
(b) Lead wires that sag below an imaginary plane across the top of the die bond (X plane only)
except by design.
(c) Any lead wire that appears to touch or cross another lead wire or bond (Y plane only).
(d) Any lead wire that deviates from a straight line from bond to external lead and appears to
touch or to be within 0.05 mm (0.002 inch) of another wire or bond (Y plane only).
(e) Any bond that is less than 0.025 mm (0.001 inch) (excluding bonds connected by a common
conductor) from another bond (Y plane only).