MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第290页

MIL-STD-883F METHOD 2016 15 November 1974 2 This page i ntenti onally lef t blank

MIL-STD-883F

METHOD 2016

15 November 1974

METHOD 2016

PHYSICAL DIMENSIONS

1. PURPOSE

. The purpose of this examination is to verify that the external physical dimensions of the device are in

accordance with the applicable acquisition document.

2. APPARATUS

. Equipment used in this examination shall include micrometers, calipers, gauges, contour projectors, or

other measuring equipment capable of determining the actual device dimensions specified in the applicable acquisition

document.

3. PROCEDURE

. Unless otherwise specified, the physical dimensions on the case outline drawing shall be measured.

3.1 Failure criteria

. Any device which exhibits a dimension or dimensions outside the specified tolerances or limits shall

constitute a failure.

4. SUMMARY

. The following detail shall be specified in the applicable acquisition document:

External dimensions which are capable of physically describing the device (see 3). Dimensions to be considered shall

include case outline dimensions; special lead shapes (e.g., required bend positions, angles of bend), where applicable;

dimensions of any projecting or indented features used for coding of lead arrangement, automatic handling and similar

purpose; and any other information which affects the installed size or orientation of the device in normal applications.

MIL-STD-883F

METHOD 2016

15 November 1974

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MIL-STD-883F

METHOD 2017.8

18 June 2004

METHOD 2017.8

INTERNAL VISUAL (HYBRID)

1. PURPOSE

. The purpose of this test is to visually inspect the internal materials, construction, and workmanship of

hybrid, multichip and multichip module microcircuits.

1.1 SCOPE

. This test is for both Class H (Class level B) and Class K (Class level S) quality levels, SAW and

hybrid/multichip/multichip module microcircuits. The following types of microcircuits may be inspected:

a. Passive thin and thick film networks.

b. Active thin and thick film circuits.

c. Multiple circuits, including combinations, stacking or other interconnections of 1.1.a and 1.1.b.

This test will normally be used on microelectronic devices prior to capping or encapsulation on a 100 percent inspection

basis to detect and eliminate devices with internal defects that could lead to device failure in normal application. It may also

be employed on a sampling basis prior to capping to determine the effectiveness of the manufacturers quality control and

handling procedures.

2. APPARATUS

. The apparatus for this test shall include optical equipment capable of the specified magnification(s) and

visual standards/aids (gages, drawings, photographs, etc.) necessary to perform an effective examination and enable the

operator to make objective decisions as to the acceptability of the device being examined. Adequate fixturing shall be

provided for handling devices during examination to promote efficient operation without inflicting damage to the units.

3. PROCEDURE

a. General

. The device shall be examined in a suitable sequence of observations within the specified magnification

range to determine compliance with the specified test condition.

b. Sequence of inspection

. The order in which criteria are presented is not a required order of examination and may

be varied at the discretion of the manufacturer. Where obscuring mounting techniques (e.g., beam lead devices,

stacked substrates, components mounting in holes or cutaways, flip chip devices, packaged devices) are

employed, the inspection criteria contained herein that cannot be performed after mounting shall be conducted

prior to mounting the element or substrate. The inspection criteria of 3.1.1 may be performed at the option of the

manufacturer prior to element attachment.

c. Inspection control

. In all cases, examination prior to final preseal inspection shall be performed under the same

quality program that is required at the final preseal inspection station. Care shall be exercised after inspections

(see 3.b), to ensure that defects created during subsequent handling will be detected and rejected at final preseal

inspection. Devices examined to 3.1 criteria shall be inspected and prepared for sealing in a 100,000 (0.5 Hm or

greater) particles/cubic foot controlled environment (class 8 of ISO 14644-1) for Class H (Class level B) and 100

(0.5 Hm or greater) particles/cubic foot controlled environment (class 5 of ISO 14644-1) for Class K (Class level S),

except that the allowable relative humidity shall be less than 65 percent. During the time interval between internal

visual inspection and preparation for sealing, devices shall be stored in a 1000 (0.5 Hm or greater) particles/cubic

foot controlled environment (class 6 of ISO 14644-1). Devices shall be in covered containers when transferred

from one controlled environment to another.

d. Reinspection

. When inspection for product acceptance or quality verification of the visual requirements herein is

conducted subsequent to the manufacturer's successful inspection, the additional inspection may be performed at

any magnification specified by the applicable test condition, unless a specific magnification is required by the

acquisition document. Where sample inspection is used rather than 100 percent reinpsection, the sampling plans

of MIL-PRF-38534 or Appendix A of MIL-PRF-38535 shall apply.