MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第291页

MIL-STD-883F METHOD 2017.8 18 June 2004 1 METHOD 2017.8 INTERNAL VISUAL (H YBRID) 1. PURPOSE . The purpos e of thi s tes t is to vis ually ins pect the inter nal mater ials , cons truc tion, and work manship of hybrid, m…

MIL-STD-883F

METHOD 2016

15 November 1974

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MIL-STD-883F

METHOD 2017.8

18 June 2004

METHOD 2017.8

INTERNAL VISUAL (HYBRID)

1. PURPOSE

. The purpose of this test is to visually inspect the internal materials, construction, and workmanship of

hybrid, multichip and multichip module microcircuits.

1.1 SCOPE

. This test is for both Class H (Class level B) and Class K (Class level S) quality levels, SAW and

hybrid/multichip/multichip module microcircuits. The following types of microcircuits may be inspected:

a. Passive thin and thick film networks.

b. Active thin and thick film circuits.

c. Multiple circuits, including combinations, stacking or other interconnections of 1.1.a and 1.1.b.

This test will normally be used on microelectronic devices prior to capping or encapsulation on a 100 percent inspection

basis to detect and eliminate devices with internal defects that could lead to device failure in normal application. It may also

be employed on a sampling basis prior to capping to determine the effectiveness of the manufacturers quality control and

handling procedures.

2. APPARATUS

. The apparatus for this test shall include optical equipment capable of the specified magnification(s) and

visual standards/aids (gages, drawings, photographs, etc.) necessary to perform an effective examination and enable the

operator to make objective decisions as to the acceptability of the device being examined. Adequate fixturing shall be

provided for handling devices during examination to promote efficient operation without inflicting damage to the units.

3. PROCEDURE

a. General

. The device shall be examined in a suitable sequence of observations within the specified magnification

range to determine compliance with the specified test condition.

b. Sequence of inspection

. The order in which criteria are presented is not a required order of examination and may

be varied at the discretion of the manufacturer. Where obscuring mounting techniques (e.g., beam lead devices,

stacked substrates, components mounting in holes or cutaways, flip chip devices, packaged devices) are

employed, the inspection criteria contained herein that cannot be performed after mounting shall be conducted

prior to mounting the element or substrate. The inspection criteria of 3.1.1 may be performed at the option of the

manufacturer prior to element attachment.

c. Inspection control

. In all cases, examination prior to final preseal inspection shall be performed under the same

quality program that is required at the final preseal inspection station. Care shall be exercised after inspections

(see 3.b), to ensure that defects created during subsequent handling will be detected and rejected at final preseal

inspection. Devices examined to 3.1 criteria shall be inspected and prepared for sealing in a 100,000 (0.5 Hm or

greater) particles/cubic foot controlled environment (class 8 of ISO 14644-1) for Class H (Class level B) and 100

(0.5 Hm or greater) particles/cubic foot controlled environment (class 5 of ISO 14644-1) for Class K (Class level S),

except that the allowable relative humidity shall be less than 65 percent. During the time interval between internal

visual inspection and preparation for sealing, devices shall be stored in a 1000 (0.5 Hm or greater) particles/cubic

foot controlled environment (class 6 of ISO 14644-1). Devices shall be in covered containers when transferred

from one controlled environment to another.

d. Reinspection

. When inspection for product acceptance or quality verification of the visual requirements herein is

conducted subsequent to the manufacturer's successful inspection, the additional inspection may be performed at

any magnification specified by the applicable test condition, unless a specific magnification is required by the

acquisition document. Where sample inspection is used rather than 100 percent reinpsection, the sampling plans

of MIL-PRF-38534 or Appendix A of MIL-PRF-38535 shall apply.

MIL-STD-883F

METHOD 2017.8

18 June 2004

e. Exclusions

. Where conditional exclusions have been allowed, specific instruction as to the location and conditions

for which the exclusion can be applied shall be documented in the assembly inspection drawing.

f. Definitions

(1) Active circuit area

includes all areas of functional circuit elements, operating metallization or connected

combinations thereof excluding beam leads.

(2) Add-on substrate

is a supporting structural material into and/or upon which glassivation, metallization and

circuit elements are placed and the entire assembly is in turn placed on, and attached to the main substrate.

(3) Attachment media

is defined as the material used to effect the attachment of an element to an underlying

surface (e.g., adhesive, solder, alloy).

(4) Bonding site

is a metallized area on a substrate or element intended for a wire or ribbon interconnecting bond.

(5) Cold solder joint

is defined as a solder joint whose appearance is "grainy" or "dull". Where a "grainy" or "dull"

appearance is characteristic of certain solder materials (e.g., AuSn, etc.), this criteria shall not be rejectable for

these materials.

(6) Compound bond

is one bond on top of another.

(7) Conductive attach

is the process and materials used for the attachment that also provides an electrical contact

or thermal dissipation path (e.g., solder, eutectic, solder-impregnated epoxy).

(8) Dielectric attach

is the process and materials used for attachment that does not provide electrical contact or

thermal dissipation considerations.

(9) Edge metallization

is the metallization that electrically connects the metallization from the top surface to the

opposite side of the substrate; also called wrap around metallization.

(10) Element

is a constituent of a hybrid microcircuit; such as integral deposited or screened passive elements,

substrates, discrete or integrated electronic parts including dice, chips and other microcomponents; also

mechanical piece parts as cases and covers; all contributing to the operation of a hybrid microcircuit.

(11) Electrically common

is satisfied when two or more conductive surfaces or interconnects are of equal DC

voltage/signal potential.

(12) End terminated or wrap around elements

are those elements which have electrical connections on the ends

(sides) and/or bottom of their bodies.

(13) Foreign material

is defined as any material that is foreign to the microcircuit of any non-foreign material that is

displaced from its original or intended position within the microcircuit package. Conductive foreign material is

defined as any substance that appears opaque under those conditions of lighting and magnification used in

routine visual inspection. Particles shall be considered embedded in glassivation when there is evidence of

color fringing around the periphery of the particle.

(14) Glassivation

is the top layer(s) of transparent insulating material that covers the active area including

metallization, except bonding pads and beam leads. Crazing is the presence of minute cracks in the

glassivation.