MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第296页

MIL-STD-883F METHOD 2017.8 18 June 2004 6 Class H Class K Note: Mec hanical s trengt h or Dielec tric attac hment may be Radiography may be us ed to asses sed thr ough Mechanic al Str ength verif y attac hment in li eu o…

MIL-STD-883F

METHOD 2017.8

18 June 2004

3.1.2 Element attachment (assembly), "magnification 10X to 60X"

. Figures 2017-1 and 2017-2 are example visual

representations of attachment media types.

NOTE: Rejection criteria are not to be derived from these examples but rather from the specific criteria paragraphs that

follow.

FIGURE 2017-1. Element attachments

. FIGURE 2017-2. Element attachments.

MIL-STD-883F

METHOD 2017.8

18 June 2004

Class H

Class K

Note: Mechanical strength or Dielectric attachment may be

Radiography may be used to assessed through Mechanical Strength

verify attachment in lieu of Testing. For conductive attachment,

visual criteria. the Qualifying Activity may approve

alternate methods for verifying

attachment integrity.

No device shall be acceptable that exhibits:

a. For non-end terminated elements, attachment media not visible around at least 50 percent of the perimeter unless

it is continuous on two full nonadjacent sides of the element.

NOTE: The criteria of paragraph 3.1.2.a shall not apply when attachment material is applied directly to more than 50

percent of the element attach area by use of a method such as preforms or printing.

b. End terminated elements that do End terminated elements that do not

not have conductive attachment have conductive attachment media

media visible around at least visible around at least 75 percent

50 percent of the visible of the visible bonding pad perimeter

bonding pad perimeter on each on each end termination. For

end termination. For dielectric attachment of end

dielectric attachment of end terminated elements (i.e., where

terminated elements (i.e., the body of the element between the

where the body of the element end terminations is attached), the

between the end terminations is criteria of (a) above applies.

attached), the criteria of (a)

above applies.

c. Glass substrates or transparent die, when viewed from the bottom, which exhibit attach area less than 50 percent.

NOTE: This criterion may be employed in lieu of 3.1.2.a.

d. Flaking of the attachment media material.

e. Balling of the solder or alloy material that does not exhibit a fillet. (see Figure 2017-3)

MIL-STD-883F

METHOD 2017.8

18 June 2004

FIGURE 2017-3. Balling of die attach material