MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第3页
MIL-STD-883F iii CONTENTS PARAGRAPH Page 1. SCO PE ....................................................................................................................... ............... 1 1.1 Purp ose ..................…
MIL-STD-883F
ii
FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense.
2. Comment, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center
Columbus ATTN: DSCC-VA, P.O. Box 3990, Columbus, OH 43218-3990, or by email to STD883@dscc.dla.mil
. Since
contact information can change, you may want to verify the currency of this address information using the ASSIST Online
database at: http://www.dodssp.daps.mil.
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MIL-STD-883F
iii
CONTENTS
PARAGRAPH Page
1. SCOPE...................................................................................................................................... 1
1.1 Purpose................................................................................................................................... 1
1.2 Intended use of or reference to MIL-STD-883.......................................................................... 1
2. APPLICABLE DOCUMENTS..................................................................................................... 3
2.1 General.................................................................................................................................... 3
2.2 Government documents........................................................................................................... 3
2.3 Non-Government publications.................................................................................................. 4
2.4 Order of precedence................................................................................................................ 5
3. ABBREVIATIONS, SYMBOLS, AND DEFINITIONS.................................................................. 6
3.1 Abbreviations, symbols, and definitions................................................................................... 6
4. GENERAL REQUIREMENTS.................................................................................................... 8
4.1 Numbering system................................................................................................................... 8
4.2 Test results.............................................................................................................................. 9
4.3 Test sample disposition........................................................................................................... 9
4.4 Orientation............................................................................................................................... 9
4.5 Test conditions ........................................................................................................................12
4.6 General precautions ................................................................................................................14
5. DETAIL REQUIREMENTS ........................................................................................................15
6. NOTES......................................................................................................................................16
FIGURES
FIGURE
1. Orientation of noncylindrical microelectronic devices to
direction of applied force............................................................................................................10
2. Orientation of cylindrical microelectronic device to
direction of applied force............................................................................................................11
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MIL-STD-883F
iv
TEST METHODS
METHOD NO. ENVIRONMENTAL TESTS
1001 Barometric pressure, reduced (altitude operation)
1002 Immersion
1003 Insulation resistance
1004.7 Moisture resistance
1005.8 Steady state life
1006 Intermittent life
1007 Agree life
1008.2 Stabilization bake
1009.8 Salt atmosphere (corrosion)
1010.8 Temperature cycling
1011.9 Thermal shock
1012.1 Thermal characteristics
1013 Dew point
1014.11 Seal
1015.9 Burn-in test
1016.1 Life/reliability characterization tests
1017.2 Neutron irradiation
1018.4 Internal water-vapor content
1019.6 Ionizing radiation (total dose) test procedure
1020.1 Dose rate induced latchup test procedure
1021.2 Dose rate upset testing of digital microcircuits
1022 Mosfet threshold voltage
1023.2 Dose rate response of linear microcircuits
1030.2 Preseal burn-in
1031 Thin film corrosion test
1032.1 Package induced soft error test procedure (due to alpha particles)
1033 Endurance life test
1034.1 Die penetrant test (for plastic devices)
MECHANICAL TESTS
2001.2 Constant acceleration
2002.4 Mechanical shock
2003.8 Solderability
2004.5 Lead integrity
2005.2 Vibration fatigue
2006.1 Vibration noise
2007.3 Vibration, variable frequency
2008.1 Visual and mechanical
2009.9 External visual
2010.11 Internal visual (monolithic)
2011.7 Bond strength (destructive bond pull test)
2012.7 Radiography
2013.1 Internal visual inspection for DPA
2014 Internal visual and mechanical
2015.13 Resistance to solvents
2016 Physical dimensions
2017.8 Internal visual (hybrid)
2018.4 Scanning electron microscope (SEM) inspection of metallization
2019.7 Die shear strength
2020.8 Particle impact noise detection test
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