MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第306页

MIL-STD-883F METHOD 2017.8 18 June 2004 16 Class H Class K 3.1. 5.7 Ribbon bonds . No devic e shall be accept able that exhibits the foll owing: a. Any tears in the r ibbon at t he juncti on between the ri bbon loop and …

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MIL-STD-883F
METHOD 2017.8
18 June 2004
15
Class H Class K
b. The number of continuous strands along the mesh is less than 50 percent of lengthwise strands through each
section. (see Figure 2017-8a).
c. Less than one continuous Less than two continuous conducting
conducting path(s) through a path(s) through a bond (see Figure
bond (see Figure 2017-8b). 2017-8b).
FIGURE 2017-8a. Criteria for strands along the mesh
.
FIGURE 2017-8b. Criteria for continuous conducting paths
.
MIL-STD-883F
METHOD 2017.8
18 June 2004
16
Class H Class K
3.1.5.7 Ribbon bonds
. No device shall be acceptable that exhibits the following:
a. Any tears in the ribbon at the junction between the ribbon loop and bond/weld.
b. Bonds which do not exhibit 100 percent bond/weld impression(s) across the width of the ribbon overlapping
underlying metallization.
NOTE: Gaps between welds on the ribbon caused by the natural footprint of a weld tip (i.e., split tip, etc.) are acceptable
provided the total of all gaps do not exceed 25 percent of the ribbon width.
c. Effective bonded area less than 50 percent of that which would be possible for an exactly aligned ribbon.
d. Bond tails longer than one ribbon width or 10.0 mils, whichever is less, or bridging adjacent metallization.
e. The unbonded end of a ribbon bond tuning stub longer than one ribbon width of 10.0 mils, whichever is less, that is
not secured by polymer adhesive.
3.1.5.8 General
. No device shall be acceptable that exhibits:
a. Bonds on the die where less Monometallic bonds on the die where less
than 50 percent of the bond than 50 percent of the bond is within
is within the unglassivated the unglassivated bonding site.
bonding site. Bimetallic bonds on the die where less
than 75 percent of the bond is within
the unglassivated bonding site.
b. Bonds on the package post or substrate that are not completely within the bonding site.
NOTE: For cases where the substrate bonding site is smaller than 1.5 times the minimum bond size, bonds on the
substrate where less than 50 percent of the bond is within the bonding site.
c. Bonds placed so that the wire exiting from a bond crosses over another bond, except by design, in which case the
clearance shall be 2.0 wire diameters minimum (common bonds are excluded from this criteria).
d. An absence of a visible line of separation between non-electrically common bonds.
e. An absence of a visible line of separation between a bond and non-electrically common metallization. This criteria
applies to both glassivated and unglassivated metallization.
f. Wire bond tails that extend over or make contact with any noncommon, unglassivated active metal.
g. Wire bond tails that exceed two wire diameters in length at the bonding pad or four wire diameters in length at the
package post.
h. Bonds on element attach media or on contaminated or foreign material.
i. Any lifted or peeling bond.
j. Intermetallic formation extending completely around the metallic interface of any bond between dissimilar metals.
MIL-STD-883F
METHOD 2017.8
18 June 2004
17
Class H Class K
k. Wedge, crescent or ball bonds at the point where metallization exits from the bonding pad that do not exhibit a line
of undisturbed metal visible between the periphery of the bond and at least one side of the entering metallization
stripe.
NOTE: Criteria of 3.1.5.8 (k) can be excluded when the entering conductor is >2 mils in width and the bond pad dimension
on the entering conductor side is >3.5 mils.
NOTE: For Class H only, the requirements for a visual line of metal can be satisfied when an acceptable wire tail obscures
the area of concern, provided the following condition exists. Bond is located more than 0.1 mil from the intersecting line of
the entering metallization stripe and the bonding pad and there is no visual evidence of disturbed pad metallization at the
bond and wire tail interface.
NOTE: Criteria 3.1.5.8 (k) is not applicable to interdigitated (Lange) couplers or when the interface between a
thermosonic/ultrasonic (i.e., non-thermocompression) bond and underlying metal is monometallic.
l. Polymeric adhesive which may be material or residue as evidenced by discoloration within 5.0 mils of the outer
periphery of a wire bond.
m. Tearing at the junction of the wire and bond. The junction is the line of deformation of the wire at the bonding site.
3.1.6 Internal leads (e.g., wires, ribbons, beams, wireloops, ribbon loops, beams, etc.), "magnification 10X to 60X"
. No
device shall be acceptable that exhibits:
a. Within the first 5.0 mils of wire from the die surface for ball bonds, or 10.0 mils for wedge bonds, any wire that
comes closer than 1.0 mil to any non-common conductive surface (e.g., unglassivated operating metallization,
unpassivated edge of conductive die).
NOTE: Insulated wires and electrically common wires are excluded from this criteria.
b. After the first 5.0 mils of wire from the die surface for ball bond(s), or 10 mils for wedge bonds, any wire that comes
closer than two wire diameters to any non-common, uninsulated conductive surface (e.g., unglassivated operating
metallization, unpassivated edge of conductive die).
NOTE: Insulated wires and electrically common wires are excluded from this criteria.
c. Nicks, cuts, crimps, scoring, sharp bends, or neckdown in any lead that reduces the lead diameter/width by more
than 25 percent.
d. Missing or extra lead(s) not in conformance with bonding diagram.
NOTE: Leads designated for tuning on the bonding diagram are excluded.
e. Any lead making a straight line run from bond to bond that has no arc, unless specifically allowed by the bonding
diagram.
f. Wire(s) crossing wire(s) with a separation of less than 2 lead widths. Common or insulated conductors and
insulated wires are excluded.
g. Complete or partial separation of the lead from the body of the element.
h. Excessive loop height such that the wire would contact the lid when it is installed.
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