MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第310页

MIL-STD-883F METHOD 2017.8 18 June 2004 20 FIGURE 2017-11a. Void cri teri a . FIGURE 2017-11b. Cr ack /adhesi on crit eria . FIGURE 2017-11c . Excess solder cri teri a . FIGURE 2017-11d. Insuff ici ent sol der cr iter ia…

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MIL-STD-883F
METHOD 2017.8
18 June 2004
19
FIGURE 2017-9 Center contact orientations to substrate.
FIGURE 2017-10. Center Contact overlap to substrate
.
MIL-STD-883F
METHOD 2017.8
18 June 2004
20
FIGURE 2017-11a. Void criteria
.
FIGURE 2017-11b. Crack/adhesion criteria
.
FIGURE 2017-11c. Excess solder criteria
.
FIGURE 2017-11d. Insufficient solder criteria
.
FIGURE 2017-11e. Solder criteria
.
MIL-STD-883F
METHOD 2017.8
18 June 2004
21
Class H Class K
3.1.9 Package conditions, "magnification 10X to 60X"
. No device will be acceptable that exhibits:
a. Unattached foreign material within the package or on the seal flange.
NOTE: All foreign material shall be considered to be unattached unless otherwise verified to be attached. Verification of
attachments of foreign material whose longest dimensions are greater than 75 percent of the closest unglassivated
conductive spacing shall be accomplished by a light touch with an appropriate mechanical device (i.e., needle, probe, pick,
etc.). Verification of attachments of smaller material can be satisfied by suitable cleaning process approved by the acquiring
activity. All foreign material or particles may be verified as attached with a nominal gas blow (approximately 20 psig).
NOTE: Semiconductor chips shall be considered foreign particles.
b. Attached foreign material that bridges metallization paths, two package leads, lead to package metallization,
functional circuit elements, junctions, or any combination thereof.
c. Liquid droplets or any chemical stain that bridges any combination of unglassivated operating metallization.
d. Physical damage or contamination (eutectic or polymer material) that prevents adequate sealing of the seal
surface.
e. Presence of any residual flux.
NOTE: Use 10X to 15X magnification.
f. Foreign material in melt that does not exhibit a fillet.
4. SUMMARY
. The following details shall be specified in the applicable acquisition document:
a. Test condition (see 3).
b. Where applicable, gages, drawings and photographs that are to be used as standards for operator comparison
(see 2).
c. Where applicable, specific magnification if other than that specified (see 3).