MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第334页

MIL-STD-883F METHOD 2018.4 18 June 2004 22 FIGURE 2018-11. 7,000X . Separati on of metall izati on at p assivatio n step (b ase con tact) (reje ct).

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MIL-STD-883F
METHOD 2018.4
18 June 2004
21
FIGURE 2018-10. (10,000X)
.
Separation of metallization at
passivation step (base contact) (accept).
MIL-STD-883F
METHOD 2018.4
18 June 2004
22
FIGURE 2018-11. 7,000X
.
Separation of metallization at
passivation step (base contact) (reject).
MIL-STD-883F
METHOD 2018.4
18 June 2004
23
FIGURE 2018-12. (6,000X)
.
Crack-like defect at passivation step (accept).