MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第336页
MIL-STD-883F METHOD 2018.4 18 June 2004 24 FIGURE 2018-13. 6,000X . Crack-like defect at p assivatio n step (re ject).

MIL-STD-883F
METHOD 2018.4
18 June 2004
23
FIGURE 2018-12. (6,000X)
.
Crack-like defect at passivation step (accept).

MIL-STD-883F
METHOD 2018.4
18 June 2004
24
FIGURE 2018-13. 6,000X
.
Crack-like defect at passivation step (reject).

MIL-STD-883F
METHOD 2018.4
18 June 2004
25
FIGURE 2018-14. (7,200X)
.
Thinning at passivation step with more than 50
percent of cross-sectional area remaining at
step (multi-level metal) (accept).