MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第337页

MIL-STD-883F METHOD 2018.4 18 June 2004 25 FI GURE 2018-14. ( 7,200X) . Thinning at passi vation s tep with mor e than 50 percent of cros s-s ect ional area r emaining at step ( multi -level metal) (acc ept).

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MIL-STD-883F
METHOD 2018.4
18 June 2004
24
FIGURE 2018-13. 6,000X
.
Crack-like defect at passivation step (reject).
MIL-STD-883F
METHOD 2018.4
18 June 2004
25
FIGURE 2018-14. (7,200X)
.
Thinning at passivation step with more than 50
percent of cross-sectional area remaining at
step (multi-level metal) (accept).
MIL-STD-883F
METHOD 2018.4
18 June 2004
26
FIGURE 2018-15. 7,200X
.
Thinning at passivation step with less than 50
percent of cross-sectional area remaining at
step (multi-level metal) (reject).