MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第341页

MIL-STD-883F METHOD 2018.4 18 June 2004 29 FI GURE 2018-18. ( 5,000X) . Peel ing or l ift ing general met alli zation in cont act wi ndow area (r eject) .

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MIL-STD-883F
METHOD 2018.4
18 June 2004
28
FIGURE 2018-17. 9,500X
.
Steep passivation step (MOS) (reject).
MIL-STD-883F
METHOD 2018.4
18 June 2004
29
FIGURE 2018-18. (5,000X)
.
Peeling or lifting general metallization
in contact window area (reject).
MIL-STD-883F
METHOD 2018.4
18 June 2004
30
FIGURE 2018-19. 10,000X
.
General metallization voids (accept).