MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第344页

MIL-STD-883F METHOD 2018.4 18 June 2004 32 FIGURE 2018-21. 5,000X . Et ch-bac k/under cut t ype of notc h at passiv ation ste p (multi-lay ered me tal) (accep t).

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MIL-STD-883F
METHOD 2018.4
18 June 2004
31
FIGURE 2018-20. (5,000X)
.
General metallization voids (reject).
MIL-STD-883F
METHOD 2018.4
18 June 2004
32
FIGURE 2018-21. 5,000X
.
Etch-back/undercut type of notch at
passivation step (multi-layered metal) (accept).
MIL-STD-883F
METHOD 2018.4
18 June 2004
33
FIGURE 2018-22. (5,000X)
. Barrier or adhesion
layer etch-back/undercut type of notch at
passivation step (multi-layered metal) (accept).