MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第345页

MIL-STD-883F METHOD 2018.4 18 June 2004 33 FIGURE 2018-22. (5, 000X) . Barr ier or adhesion layer etc h-back /under cut t ype of notc h at pass ivation s tep (m ulti- layered met al) ( accept ).

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MIL-STD-883F
METHOD 2018.4
18 June 2004
32
FIGURE 2018-21. 5,000X
.
Etch-back/undercut type of notch at
passivation step (multi-layered metal) (accept).
MIL-STD-883F
METHOD 2018.4
18 June 2004
33
FIGURE 2018-22. (5,000X)
. Barrier or adhesion
layer etch-back/undercut type of notch at
passivation step (multi-layered metal) (accept).
MIL-STD-883F
METHOD 2018.4
18 June 2004
34
FIGURE 2018-23. Concept of reduction of cross-sectional area of metallization
as accept/reject criteria (any combination of defects and thinning over a step which reduces
the cross-sectional area of the metal to less than the percentage defined within 3.7.2 of
metal cross-sectional area as deposited on the flat surface) is cause for rejection
.