MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第346页

MIL-STD-883F METHOD 2018.4 18 June 2004 34 FIGURE 2018-23. Concept of reduct ion of c ross -sec tional area of met allizat ion as acc ept/r eject c ri teria ( any combi nation of def ects and thinni ng over a st ep which…

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MIL-STD-883F
METHOD 2018.4
18 June 2004
33
FIGURE 2018-22. (5,000X)
. Barrier or adhesion
layer etch-back/undercut type of notch at
passivation step (multi-layered metal) (accept).
MIL-STD-883F
METHOD 2018.4
18 June 2004
34
FIGURE 2018-23. Concept of reduction of cross-sectional area of metallization
as accept/reject criteria (any combination of defects and thinning over a step which reduces
the cross-sectional area of the metal to less than the percentage defined within 3.7.2 of
metal cross-sectional area as deposited on the flat surface) is cause for rejection
.
MIL-STD-883F
METHOD 2018.4
18 June 2004
35
Figure 2018.24 20% metallization coverage (barrier metal inclusive)
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