MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第397页

MIL-STD-883F METHOD 2028.4 27 July 1990 1 METHOD 2028.4 PIN-GRID PACKAGE DESTRUCTIVE LEAD PULL TEST 1. PURPOSE . This method provi des a tes t for determini ng the int egrit y of pin-gr id type pac kage leads by measur i…

MIL-STD-883F

METHOD 2027.2

22 March 1989

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MIL-STD-883F

METHOD 2028.4

27 July 1990

METHOD 2028.4

PIN-GRID PACKAGE DESTRUCTIVE LEAD PULL TEST

1. PURPOSE

. This method provides a test for determining the integrity of pin-grid type package leads by measuring the

capability of the package leads to withstand an axial force.

2. APPARATUS

. The apparatus for this test shall consist of suitable equipment for supplying the specified stress to the

package lead. A calibrated measurement and indication of the applied stress in grams-force (gf) shall be provided by

equipment capable of measuring stresses up to twice the specified minimum limit value, with an accuracy of ±5 percent or

±0.25 kgf, whichever is greater.

3. PROCEDURE

. The stress shall be applied to the leads to be tested randomly selected from a minimum of 3 devices

prior to start of the test. Tension only shall be applied, without shock, to each lead to be tested in a direction parallel to the

axis of the lead. The tension shall be increased until the minimum acceptable pull strength is reached or upon separation of

the lead from the braze pad. The tension shall be applied as close to the end of the lead as possible.

3.1 Failure criteria

. The minimum acceptable lead pull strength shall be 1.70 X 10

grams-force per square inch of

cross-sectional lead area (e.g., the minimum pull strength of a lead with an average cross-sectional area of 2.5 x 10

-4

will

be 4.3 kgf.)

4. SUMMARY

. The following details shall be specified in the applicable acquisition document:

a. Number and selection of leads, if different from above.

b. Measured lead pull strength and minimum required pull strength, if different from above.

MIL-STD-883F

METHOD 2028.4

27 July 1990

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