MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第410页

MIL-STD-883F METHOD 2032.2 18 June 2004 4 (16) Mar is a nontear ing sur fac e dist urbance s uch as an i ndentati on or a buff mark. (17) Metalliza tion, mu ltilevel (c onductors ) is al ternat e layers of metall izati o…

MIL-STD-883F

METHOD 2032.2

18 June 2004

(6) Contact window is an opening (usually square) through the oxide (or insulating) layer for the purpose of

allowing contact by deposited material to the substrate.

(7) Controlled environment

is one that has 1,000 or fewer (0.5 Hm or greater) particles/cubic foot in a controlled

environment in accordance with the requirements of ISO 14644-1 for a class 6 clean environment, except

that the maximum allowable relative humidity shall not exceed 65 percent.

(8) Corrosion

is the gradual wearing away of metal, usually by chemical action, with the subsequent production

of a corrosion product.

(9) Crazing

is the presence of numerous, minute, interconnected surface cracks.

(10) Crossover

is the transverse crossing of metallization paths, without mutual electrical contact, achieved by

the deposition of an insulating layer between the metallization paths in the area of crossing.

(11) Detritus

is fragments of original or trim-modified resistor or conductor material.

(12) Dielectric

is an insulating material that does not conduct electricity but may be able to sustain an electric

field. It can be used in crossovers, as a passivation or a glassivation, or in capacitors.

(13) Foreign material

is any material that is foreign to the element or any nonforeign material that is displaced

from its original or intended position in the element. It is considered attached when it cannot be removed by

a nominal gas blow (approximately 20 psig) or by an approved cleaning process. Conductive foreign

material is any substance that appears opaque under those conditions of lighting and magnification used in

routine visual inspection. Particles are considered to be embedded in glassivation when there is evidence of

color fringing around the periphery of the particle.

(14) Glassivation

is the top layer(s) of transparent insulating material that covers the active circuit area, including

metallization, but not bonding pads. Crazing is the presence of numerous minute cracks in the glassivation.

Cracks are fissures in the glassivation layer resulting from stress release or poor adhesion. The cracks can

form loops over metallized areas.

(15) Kerf

is the clear area in a trimmed resistor resulting from the removal of resistor material by the trimming

operation. In laser trimming, the kerf is bounded by the reflow zone (which is characterized by adherent,

melted resistor material), the scorched heat-affected zone (which is characterized by discoloration of the

resistor film without alteration of its physical form), and the undisturbed zone.

MIL-STD-883F

METHOD 2032.2

18 June 2004

(16) Mar is a nontearing surface disturbance such as an indentation or a buff mark.

(17) Metallization, multilevel (conductors)

is alternate layers of metallization, or other material used for

interconnection, that are isolated from each other by a grown or deposited insulating material. The term

"overlaying metallization" refers to any metallization layer on top of the insulating material.

(18) Metallization, multilayered (conductors)

is two or more layers of metallization, or other material used for

interconnection, that are not isolated from each other by a grown or deposited insulating material. The term

"underlying metallization" refers to any metallization layer below the top layer of metallization.

(19) Metallization, operating (conductors)

is all metallization (gold, aluminum, or other material) used for

interconnection. Bonding pads are considered to be operating metallization. Alignment markers, test

patterns, and identification markings are not considered to be operating metallization.

(20) Narrowest resistor width

is the narrowest portion of a given resistor prior to trimming; however, the

narrowest resistor width for a block resistor may be specified in the approved manufacturer's design

documentation.

(21) Neck-down

is tapering of a resistor line at a metallization interface. Resistor material taper is typically equal

on both sides of the line and is less abrupt than a void.

(22) Nicking (partial cut)

is incomplete or inadvertent trimming of a resistor adjacent to the one being trimmed or

of the next ladder rung of the same resistor.

(23) Nonplanar element

is one that is essentially three-dimensional.

(24) Original separation

is the separation dimension or space that is intended by design.

(25) Original width

is the width dimension that is intended by design.

(26) Oxide defect

is an irregularly shaped defect in the oxide characterized by two or three colored fringes at it

edges.

(27) Passivation

is the silicon oxide, silicon nitride, or other insulating material, that is grown or deposited directly

on the element prior to the deposition of metal.

(28) Passivation step

is a change in thickness of the passivation layer by design.

(29) Passive elements

are planar resistors, capacitors, inductors, and patterned substrates (both single-layer

and multilayer), and nonplanar chip capacitors, chip resistors, chip inductors, and transformers.

(30) Patterned substrate

is a substrate on which conductors, and components such as resistors or capacitors,

are formed using thick or thin film manufacturing techniques.

(31) Planar element

is one that is essentially two-dimensional with all points in a common plane.

(32) Protrusion

is a jutting-out of a circuit feature. Protrusion is typically caused by a photolithographic or

screening defect.

(33) Resistor ladder

is a resistor structure resembling a ladder in appearance that can be trimmed in incremental

steps. A coarse ladder structure is one in which trimming of a rung results in a large incremental resistance

change (one that can cause an out-of-tolerance condition to occur). A fine ladder structure is one in which

trimming of a rung results in a small incremental resistance change (one that can not cause an

out-of-tolerance condition to occur).

MIL-STD-883F

METHOD 2032.2

18 June 2004

(34) Resistor ladder rung is that portion of a resistor ladder structure intended to be laser trimmed to result in an

incremental change in resistance.

(35) Resistor loop

is a resistor structure resembling a loop in appearance that can be trimmed. A coarse loop

structure is one in which trimming results in a large resistance change (one that can cause an

out-of-tolerance condition to occur). A fine loop structure is one in which trimming results in a small

resistance change (one that cannot cause an out-of-tolerance condition to occur).

(36) Resistor material, self passivating

is one on which a conformal insulating layer can be thermally grown (such

as tantalum nitride on which tantalum pentoxide is grown).

(37) Scorching

is discoloration of laser trimmed thin film resistor material without alteration of its physical form.

(38) Scratch, metallization

is any tearing defect, including probe marks, in the surface of the metallization. A mar

on the metallization surface is not considered to be a scratch.

(39) Scratch, resistor

is any tearing defect in the resistor film. A mar on the resistor surface is not considered to

be a scratch.

(40) Sidebar

is that portion of a resistor ladder structure to which rungs are attached. Sidebars are not intended

to be laser trimmed.

(41) Substrate

is the supporting structural material into or upon which, or both, functional circuits are formed.

(42) Surface Acoustic Wave (SAW) element

is a planar element fabricated typically using thin film manufacturing

techniques on various substrate materials. Size varies as a function of frequency and design features

include interdigitated fingers.

(43) Terminal

is a metal area used to provide an electrical access point to functional circuitry.

(44) Thick film

is conductive, resistive or dielectric material screen printed onto a substrate and fired at

temperature to fuse into its final form.

(45) Thin film

is conductive, resistive or dielectric material, usually less than 50,000Å in thickness, that is

deposited onto a substrate by vacuum evaporation, sputtering, or other means.

(46) Underlying material

is any layer of material below the top-layer metallization. This includes metallization,

resistor, passivation or insulating layers, or the substrate itself.

(47) Via

is an opening in the insulating material in which a vertical conductive electrical connection from one

metallization layer to another is made.

(48) Vitrification

is conversion into glass or a glassy substance by heat and fusion.

(49) Void, metallization

is any missing metallization where the underlying material is visible (exposed). Voids

typically are caused by photolithographic, screen, or mask related defects, not by scratches.

(50) Void, resistor

is any missing resistor material where the underlying material is visible (exposed). Voids

typically are caused by photolithographic, screen, or mask related defects, not by scratches.