MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第433页

MIL-STD-883F METHOD 2032.2 18 June 2004 27 C lass H Cla ss K 3.1. 6 l. Br idging wit hin the s ame resi stor pattern 3.1.6 l. Same as clas s H. where the wi dth of the br idge is less than 50 percent of the nar rowest li…

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MIL-STD-883F
METHOD 2032.2
18 June 2004
26
Class H Class K
3.1.6 j. Any increase in resistor width of a block 3.1.6 j. Same as class H.
resistor greater than 25 percent of the
original resistor width (see figure 2032-20h).
FIGURE 2032-20h. Class H resistor width increase criterion
.
k. Protruding resistor material within the same k. Same as class H.
resistor structure that reduces the original
separation to less than 50 percent (see
figure 2032-21h).
NOTE: This criteria applies to protrusion of
resistor material resulting from a photo-
lithographic defect.
FIGURE 2032-21h. Class H protusion of resistor material criterion
.
MIL-STD-883F
METHOD 2032.2
18 June 2004
27
Class H Class K
3.1.6 l. Bridging within the same resistor pattern 3.1.6 l. Same as class H.
where the width of the bridge is less than
50 percent of the narrowest line being
bridged (see figure 2032-22h).
FIGURE 2032-22h. Class H bridging of resistor material criteria
.
3.1.7 Laser trimmed thin film resistor defects,
"high magnification"
. No element shall be acceptable
that exhibits:
NOTE: The laser trim defect criteria contained in
this section apply to active resistor areas only.
MIL-STD-883F
METHOD 2032.2
18 June 2004
28
Class H Class K
3.1.7 a. A kerf width less than 0.1 mil (see 3.1.7 a. Same as class H.
figure 2032-23h).
NOTE: This does not apply to edge trimming.
FIGURE 2032-23h. Class H kerf width criteria
.
b. A kerf containing particles of detritus. b. Same as class H.
NOTE: For resistor materials that are
self-passivating (such as tantalum nitride),
detritus in the kerf is allowed provided
that a clear path of at least 0.1 mil in
width exists in the kerf. Such detritus
shall be attached. Verification of
attachment shall be accomplished using
the techniques described in 3.1.5a
(see figure 2032-24h).
NOTE: This does not apply to edge
trimming.