MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第44页
MIL-STD-883F METHOD 1006 1 May 1968 2 This page i ntenti onally lef t blank .
MIL-STD-883F
METHOD 1006
1 May 1968
1
METHOD 1006
INTERMITTENT LIFE
1. PURPOSE
. The intermittent life test is performed for the purpose of determining a representative failure rate for
microelectronic devices or demonstrating quality or reliability of devices subjected to the specified conditions. It is intended
for applications where the devices are exposed to cyclic variations in electrical stresses between the "on" and "off" condition
and resultant cyclic variations in device and case temperatures.
2. APPARATUS
. See method 1005 of this standard.
3. PROCEDURE
. The device shall be tested in accordance with all the requirements of method 1005 except that all
electrical stresses shall be alternately applied and removed. The "on" and "off" periods shall be initiated by sudden, not
gradual, application or removal of the specified electrical inputs (including signal and bias).
4. SUMMARY
. In addition to the requirements of method 1005 of this standard, the following detail shall be specified in
the applicable acquisition document:
Frequency and duration of "on" and "off" cycles
MIL-STD-883F
METHOD 1006
1 May 1968
2
This page intentionally left blank
.
MIL-STD-883F
METHOD 1007
1 May 1968
1
METHOD 1007
AGREE LIFE
1. PURPOSE
. The purpose of this test is to determine a representative failure rate for microelectronic devices or to
demonstrate quality or reliability of devices subjected to the specified conditions where test conditions include a combination
of temperature cycling, on-off electrical stressing and vibration to simulate as closely as possible actual system applications
and environments.
2. APPARATUS
. The apparatus required shall be described in method 1005 of this standard except that the temperature
chambers shall be capable of following the specified test profile of figures 1 or 2 of MIL-STD-781 and suitable equipment
shall be provided to satisfy the requirements for vibration as specified.
3. PROCEDURE
. This test shall be conducted in accordance with all the requirements of method 1005 of this standard
with the exceptions that temperature shall be cycled, periodic vibration shall be applied, and electrical stresses shall be
applied in on-off cycles where and as required in the specified test level of MIL-STD-781. Only test levels E, F, G, H and J
of MIL-STD-781 shall be considered acceptable as test conditions. Selection of the temperature range should take into
account the temperature rise associated with the devices under test.
Test conditions
for method 1007
Test level
in accordance with
MIL-STD-781
Temperature range
°C
A E -54 to +55
B F -54 to +71
C G -54 to +95
D H -65 to +71
E J -54 to +125
F Test level F with
modified low
temperature
0 to +70
4. SUMMARY
. In addition to the requirements of method 1005 of this standard, the following details shall be specified in
the applicable acquisition document:
a. Test condition (see 3).
b. Test profile, specify figure 1 or 2 MIL-STD-781 and specify on-time and transfer-times, as applicable.
c. Total on-time