MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第446页

MIL-STD-883F METHOD 2032.2 18 June 2004 40 3.2 Planar thic k f ilm el ement ins pection . Ins pecti on for vis ual defec ts descr ibed in t his s ecti on shall be conduct ed on each planar thic k fi lm pas sive el ement.…

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MIL-STD-883F
METHOD 2032.2
18 June 2004
39
FIGURE 2032-37Ah. Class H and class K coupling (air) bridge criteria
.
MIL-STD-883F
METHOD 2032.2
18 June 2004
40
3.2 Planar thick film element inspection. Inspection for visual defects described in this section shall be
conducted on each planar thick film passive element. All inspection shall be performed at "low
magnification" within the range of 10X to 60X magnification for both class H and class K.
Class H
Class K
3.2.1 Operating metallization defects "low
magnification"
. No element shall be acceptable
that exhibits:
NOTE: The metallization defect criteria
contained in this section apply to operating
metallization only.
3.2.1.1 Metallization scratches
a. A scratch or probe mark in the metallization, a. Same as Class H.
excluding bonding pads, that both exposes
underlying material anywhere along its
length and leaves less than 50 percent of
the original metallization width undisturbed
(see figure 2032-38h).
NOTE: Underlying material does not have to be
exposed along the full length of the scratch.
NOTE: This criteria does not apply to
capacitors.
FIGURE 2032-38h. Class H metallization scratch criteria
.
MIL-STD-883F
METHOD 2032.2
18 June 2004
41
Class H Class K
3.2.1.1 b. Scratch in the bonding pad area that 3.2.1.1 b. Less than 75 percent
both exposes underlying material and reduces (see figure 2032-39k).
the metallization path width, where it enters
the bonding pad, to less than 50 percent
its original metallization width. If two or
more metallization paths enter a bonding pad,
each shall be considered separately (see figure
2032-39h).
FIGURE 2032-39h. Class H metallization width
FIGURE 2032-39k. Class K metallization width
reduction at bonding pad
reduction at bonding pad
criteria
. criteria.
c. Scratch or probe marks in the bonding pad c. Same as class H
area that expose underlying material over
more than 25 percent of the original
metallization area.