MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第453页

MIL-STD-883F METHOD 2032.2 18 June 2004 47 Class H Class K 3.2.2 Subs trat e defect s, "low magni fic ation" . No element s hall be ac ceptabl e that exhibit s: a. Les s than 1. 0 mil s eparati on between the a…

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MIL-STD-883F
METHOD 2032.2
18 June 2004
46
3.2.1.9 Substrate plug via defects, “low magnification”
. When inspected from each side of the substrate, no element shall
be acceptable that exhibits:
a. A complete void through the via.
b. Any lifting, peeling, or blistering of the via metallization.
c. Via fill less than 75% of the total surface area of the via plug and less than 75% of the substrate thickness.
NOTE: These are minimum requirements. Via flatness and other requirements shall be in accordance with the
applicable detail drawings.
FIGURE 2032-43Bh. Classes H and K via fill criteria
.
MIL-STD-883F
METHOD 2032.2
18 June 2004
47
Class H Class K
3.2.2 Substrate defects, "low magnification"
.
No element shall be acceptable that exhibits:
a. Less than 1.0 mil separation between the a. Same as class H.
operating metallization and the edge of the
element unless by design (see figure 2032-43h).
NOTE: This criterion does not apply to
substrates designed for wraparound conductors.
b. A chipout that extends into the b. Same as class H.
active circuit area (see figure 2032-43h).
FIGURE 2032-43h. Class H separation and chipout criteria
.
c. Any crack that exceeds 5.0 mils in length
c. Same as Class H.
(see figure 2032-44h).
NOTE: For fused quart or crystalline
substrates, no cracking is allowed.
d. Any crack that does not exhibit 1.0 mil of d. Same as class H.
separation from any active circuit area or
operating metallization (see figure 2032-44h).
*
*
MIL-STD-883F
METHOD 2032.2
18 June 2004
48
Class H Class K
FIGURE 2032-44h. Class H additional crack criteria
.
3.2.2 e. Any crack exceeding 1.0 mil in length 3.2.2 e. Same as class H.
extending from the element edge directly
towards the active circuit area or
operating metallization (see figure
2032-44h).
f. N/A f. Semicircular crack or combination of
cracks along the element edge whose total
length is equal to or greater than 75
percent of the narrowest separation
between any two bonding pads (see figure
2032-45k).
FIGURE 2032-45k. Class K semicircular
crack criterion
.