MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第454页

MIL-STD-883F METHOD 2032.2 18 June 2004 48 Cla ss H Class K FIGURE 2032-44h. Class H additional crac k c riter ia . 3.2. 2 e. Any c rac k exceeding 1. 0 mil in l ength 3.2.2 e. Same as clas s H. extending from t he eleme…

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MIL-STD-883F
METHOD 2032.2
18 June 2004
47
Class H Class K
3.2.2 Substrate defects, "low magnification"
.
No element shall be acceptable that exhibits:
a. Less than 1.0 mil separation between the a. Same as class H.
operating metallization and the edge of the
element unless by design (see figure 2032-43h).
NOTE: This criterion does not apply to
substrates designed for wraparound conductors.
b. A chipout that extends into the b. Same as class H.
active circuit area (see figure 2032-43h).
FIGURE 2032-43h. Class H separation and chipout criteria
.
c. Any crack that exceeds 5.0 mils in length
c. Same as Class H.
(see figure 2032-44h).
NOTE: For fused quart or crystalline
substrates, no cracking is allowed.
d. Any crack that does not exhibit 1.0 mil of d. Same as class H.
separation from any active circuit area or
operating metallization (see figure 2032-44h).
*
*
MIL-STD-883F
METHOD 2032.2
18 June 2004
48
Class H Class K
FIGURE 2032-44h. Class H additional crack criteria
.
3.2.2 e. Any crack exceeding 1.0 mil in length 3.2.2 e. Same as class H.
extending from the element edge directly
towards the active circuit area or
operating metallization (see figure
2032-44h).
f. N/A f. Semicircular crack or combination of
cracks along the element edge whose total
length is equal to or greater than 75
percent of the narrowest separation
between any two bonding pads (see figure
2032-45k).
FIGURE 2032-45k. Class K semicircular
crack criterion
.
MIL-STD-883F
METHOD 2032.2
18 June 2004
49
Class H Class K
3.2.2 g. An attached portion of a circuit 3.2.2 g. Same as class H.
area from an adjacent element.
h. Any crack that does not originate at an h. Same as class H.
edge.
i. Holes through the substrate, unless by i. Same as class H.
design.
j. Patterned substrates having a section broken j. Same as class H.
out around a substrate mounting hole
(intended for substrate-to-post attachment)
that is greater than 25 percent of the
mounting hole circumference.