MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第46页

MIL-STD-883F METHOD 1007 1 May 1968 2 This page i ntenti onally lef t blank .

MIL-STD-883F

METHOD 1007

1 May 1968

METHOD 1007

AGREE LIFE

1. PURPOSE

. The purpose of this test is to determine a representative failure rate for microelectronic devices or to

demonstrate quality or reliability of devices subjected to the specified conditions where test conditions include a combination

of temperature cycling, on-off electrical stressing and vibration to simulate as closely as possible actual system applications

and environments.

2. APPARATUS

. The apparatus required shall be described in method 1005 of this standard except that the temperature

chambers shall be capable of following the specified test profile of figures 1 or 2 of MIL-STD-781 and suitable equipment

shall be provided to satisfy the requirements for vibration as specified.

3. PROCEDURE

. This test shall be conducted in accordance with all the requirements of method 1005 of this standard

with the exceptions that temperature shall be cycled, periodic vibration shall be applied, and electrical stresses shall be

applied in on-off cycles where and as required in the specified test level of MIL-STD-781. Only test levels E, F, G, H and J

of MIL-STD-781 shall be considered acceptable as test conditions. Selection of the temperature range should take into

account the temperature rise associated with the devices under test.

Test conditions

for method 1007

Test level

in accordance with

MIL-STD-781

Temperature range

°C

A E -54 to +55

B F -54 to +71

C G -54 to +95

D H -65 to +71

E J -54 to +125

F Test level F with

modified low

temperature

0 to +70

4. SUMMARY

. In addition to the requirements of method 1005 of this standard, the following details shall be specified in

the applicable acquisition document:

a. Test condition (see 3).

b. Test profile, specify figure 1 or 2 MIL-STD-781 and specify on-time and transfer-times, as applicable.

c. Total on-time

MIL-STD-883F

METHOD 1007

1 May 1968

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MIL-STD-883F

METHOD 1008.2

25 August 1993

METHOD 1008.2

STABILIZATION BAKE

1. PURPOSE

. The purpose of this test is to determine the effect on microelectronic devices of storage at elevated

temperatures without electrical stress applied. This method may also be used in a screening sequence or as a

preconditioning treatment prior to the conduct of other tests. This test shall not be used to determine device failure rates for

other than storage conditions. It may be desirable to make end point and, where applicable, intermediate measurements on

a serialized device basis or on the basis of a histogram distribution by total sample in order to increase the sensitivity of the

test to parameter degradation or the progression of specific failure mechanisms with time and temperature.

2. APPARATUS

. The apparatus required for this test shall consist of a controlled temperature chamber capable of

maintaining the specified temperature and suitable electrical equipment to make the specified end point measurements.

3. PROCEDURE

. The device shall be stored at the specified ambient conditions for the specified time. The time at high

temperature shall be sufficient to allow the total mass of each device under test to reach the specified temperature before

the specified time duration begins. Within the time interval of 24 hours before (0 hours before test durations less than 250

hours) to 72 hours after the specified duration of the test, the device shall be removed from the specified ambient test

condition and allowed to reach standard test conditions. When specified, end-point measurements shall be completed

within 96 hours after removal of device from the specified ambient test condition. When specified (or at the manufacturer's

discretion, if not specified) intermediate measurements shall be made at intermediate points.

3.1 Test condition

. The ambient test temperature shall be indicated by specifying a test condition letter from the following

table. The specified test temperature is the minimum actual ambient temperature to which all devices in the working area of

the chamber are exposed. This shall be assured by making whatever adjustments are necessary in the chamber profile,

loading, location of control or monitoring instruments, and the flow of air or other chamber atmosphere. Therefore,

calibration, shall be accomplished on the chamber in a fully, loaded, unpowered configuration, and the indicator sensor

located at, or adjusted to reflect, the coldest point in the working area. Unless otherwise specified, test condition C

minimum, with a minimum time duration and temperature as specified in table I, shall apply. Unless otherwise specified, the

test duration for all other test conditions shall be 24 hours minimum.

Test condition

Temperature (minimum)

A 75°C

B 125°C

C See table I

D 200°C

E 250°C

F 300°C

G 350°C

H 400°C