MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第471页
MIL-STD-883F METHOD 2032.2 18 June 2004 65 3.4 Surf ace acous tic wave (SAW ) element i nspect ion . I nspec tion for vis ual defec ts des cri bed in thi s sec tion s hall be conduct ed on each SAW element. W hen inspec …
MIL-STD-883F
METHOD 2032.2
18 June 2004
64
Class H Class K
3.3.7 e. Build-up of termination material on metallized 3.3.7 e. Same as class H.
termination areas greater than 3.0 mils high
for weldable metallized terminations or 8.0 mils
high for solderable metallized terminations
(see figure 2032-65h).
FIGURE 2032-65h. Class H termination material buildup criteria
.
Class H
Class K
f. Termination material splattered throughout f. Same as class H.
the resistor (see figure 2032-66h).
FIGURE 2032-66h. Class H termination material splatter criteria
.
MIL-STD-883F
METHOD 2032.2
18 June 2004
65
3.4 Surface acoustic wave (SAW) element inspection. Inspection for visual defects described in this section shall be
conducted on each SAW element. When inspection is performed prior to mounting, then SAW elements may be inspected
using backlighting. All inspection shall be performed at "low magnification" within the range of 10X to 60X for both class H
and class K.
3.4.1 Defect control
. The manufacturer shall perform an audit on a weekly basis for the presence of process related
defects which impact SAW device performance (e.g., metallization voids, metallization scratches, metallization bridging, or
crystal material pits/scratches/chipouts). This audit may be satisfied during routine internal visual inspection. If the
presence of process related defects are discovered, the manufacturer shall monitor for a defect pattern to be used for the
improvement of process controls. The manufacturer shall document the results of his investigation and corrective action to
eliminate trends. The intent of this procedure is to require monitoring of process related defects which affect SAW device
performance but do not cause reliability degradation leading to eventual failure of device function.
Class H
Class K
3.4.2 Operating metallization defects "low
magnification." No element shall be acceptable
that exhibits:
3.4.2.1 Metallization corrosion
.
a. Any metallization corrosion. a. Same as class H.
3.4.2.2 Metallization adherence
.
a. Any metallization lifting, peeling or a. Same as class H.
blistering.
3.4.3 Substrate material defects "low magnification"
.
No element shall be acceptable that exhibits:
a. Any crack that exceeds 5.0 mils in length. a. Same as class H.
b. Any crack that is within 0.1 mil of any b. Same as class H.
active circuit area or operating
metallization.
c. Any crack exceeding 1.0 mil in length c. Same as class H.
extending from the element edge directly
toward the active circuit area or operating
metallization.
MIL-STD-883F
METHOD 2032.2
18 June 2004
66
Class H Class K
3.4.4 Foreign material defects "low magnification"
.
No element shall be acceptable that exhibits:
a. For mounted and unmounted elements, unattached a. Same as class H.
conductive foreign material on the surface of
the element that is large enough to bridge
operating metallization paths.
NOTE: All foreign material shall be considered
to be unattached unless otherwise verified to
be attached. Verification of attachment shall
be accomplished by a light touch with a
mechanical device (i.e., needle, probe, pick,
etc.) or by a suitable cleaning process
approved by the acquiring activity, or by a
nominal gas blow (approximately 20 psig).
Removal of unattached foreign material may be
attempted using the techniques for
verification of attachment discussed above.
b. Liquid droplets, ink drops, or chemical stains b. Same as class H.
that appear to bridge unglassivated
metallization.
c. Attached foreign material that covers greater c. Same as class H.
than 25 percent of a bonding pad area.
4. SUMMARY
. The following details shall be specified in the applicable acquisition document:
a. Class H or class K visual requirements.
b. Where applicable, any conflicts with element design, topology or construction (see 3).
c. Where applicable, gauges, drawings and photographs that are to be used as standards for operator
comparison (see 2).
d. Where applicable, magnifications other than those specified (see 3).