MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第477页
MIL-STD-883F METHOD 2035 19 August 1994 5 FIGURE 2035-4. Rejectabl e disc ontinuous bond area . FIGURE 2035-5. Lateral mi sali gned bond area . FIGURE 2035-6. Longitudi nal mis aligned bond ar ea . *
MIL-STD-883F
METHOD 2035
19 August 1994
4
FIGURE 2035-1. Bond area
.
FIGURE 2035-2. Acceptable bond area
. FIGURE 2035-3. Rejectable bond area.
MIL-STD-883F
METHOD 2035
19 August 1994
5
FIGURE 2035-4. Rejectable discontinuous bond area
.
FIGURE 2035-5. Lateral misaligned bond area
. FIGURE 2035-6. Longitudinal misaligned bond area.
*
MIL-STD-883F
METHOD 2035
19 August 1994
6
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