MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第534页
MIL-STD-883F METHOD 3019.1 22 March 1989 2 2. APPARATUS . The apparatus us ed for gr ound impedanc e measurement s shal l inc lude a sui table RF induc tanc e meter and a suit able m illiohmme ter. 2.1 RF inductance met …
MIL-STD-883F
METHOD 3019.1
22 March 1989
1
METHOD 3019.1
GROUND AND POWER SUPPLY IMPEDANCE MEASUREMENTS FOR MICROELECTRONICS DEVICE PACKAGE
1. PURPOSE
. This method establishes the means of measuring the series impedance of the ground and power supply
circuit pin configurations for packages used for complex, wide bandwidth microcircuits. The method provides data that are
useful in the evaluation of the relative performance of various packages and can be used to predict the contribution of the
package to power supply noise and ground noise.
1.1 Definition
.
1.1.1 Ground or power supply impedance
. The series combination of inductive reactance and resistance exhibited by all
of the conductor paths between the semiconductor chip interface and the exterior package interface in either the ground
circuit or the power supply circuit. The impedance of a series inductive circuit is defined by the equation:
Z =
R
+
X
L
22
1.2 Symbols
. The following symbols shall apply for purposes of this test method and shall be used in conjunction with the
definition provided in 1.1.
L
G
: Series inductance of the ground circuit path in a package (henries).
L
p
: Series inductance of the power supply circuit path in a package (henries).
X
G
: Series inductive reactance of ground path = 2 π fL
p
(ohms).
X
p
: Series inductive reactance of power supply path = 2 π fL
p
(ohms).
f: Frequency (Hz).
f
tr
: Frequency of primary component of digital pulse transition = 1 (Hz).
t
t
f
tp
: Frequency related to noise pulse width specified for the logic system:
tp
(Hz)
Pmin
f
=
1
t
t
t
: Transition time from logic system. Equal to the smaller value of low to high or high to low transition.
Z
G
: Series impedance of ground path at frequency:
G
2
G
2
G
Z
= R + Z
Z
p
: Series impedance of power supply path at frequency:
p
2
p
2
p
Z
=
R
+
Z
t
Pmin
: The minimum noise pulse width at either the V
IH
or V
IL
level specified for a given logic system.
MIL-STD-883F
METHOD 3019.1
22 March 1989
2
2. APPARATUS. The apparatus used for ground impedance measurements shall include a suitable RF inductance meter
and a suitable milliohmmeter.
2.1 RF inductance meter
. The RF inductance meter (or multi-frequency LCR meter) shall be capable of ac
measurements of series inductance over the range of 1 nH to 1,000 nH at a frequency of 100 kHz with an accuracy of ±5
percent including test fixture errors.
2.2 Milliohmmeter
. The milliohmmeter (or LCR meter) shall be capable of measuring resistance using a 4-wire method
over the range from 10 M
Ω to 10 Ω with an accuracy of ±5 percent, including test fixture errors.
3. PROCEDURE
. Measurement of series ground impedance (Z
G
) and power supply impedance (Z
p
) shall be made for all
standard power and ground configurations specified for the package application. Measurements shall be performed in
accordance with 3.2.
3.1 General considerations
. Accurate measurement of series impedance requires careful design and implementation of
test adapters to minimize errors. Since the inductance and resistance values being measured are usually quite small,
means must be provided to null out the tare resistance and inductance of the test adapters through 4-wire methods and
substraction techniques. The tare values of the interconnecting circuits must be small to enable the meters to read on
ranges that provide adequate resolution and accuracy. The techniques specified herein are adequate for predicting
impedance at frequencies up to 1 GHz. Impedance shall be evaluated at a frequency related to either the transition time:
tr
tr
f
=
1
t
or to the noise pulse width of the logic system used in the package:
tp
Pmin
f
=
1
t
The frequency f shall be as specified in the acquisition document.
The configuration of the package being tested must be the same as in the application. Wirebonds and other interconnection
media must be included in the measurement. The package should be mounted on a dielectric holding fixture to avoid stray
capacitance between the package and test equipment ground planes. Sockets should not be used unless specified.
Package leads must be trimmed to applications specifications.
3.2 Test procedure for series impedance
.
3.2.1 Series inductance
. With the inductance meter, measure the series inductance of the power supply circuit (L
p
)
between the external package solder interface and the chip power supply location. Similarly, measure the inductance of the
ground circuit (L
G
). Calculate X
p
= 2 π fL
p
and X
G
= 2 π fL
G
.
3.2.2 Series resistance
. With the milliohmmeter, measure the series resistance of the same power and ground circuits:
R
P
and R
G
.
3.2.3 Calculation of impedance
.
Calculate
Z
=
X
+
R
p
p
2
2
p
G
2
G
2
G
A
= X +R
MIL-STD-883F
METHOD 3019.1
22 March 1989
3
4. SUMMARY. The following details, when applicable, shall be specified in the applicable acquisition document.
a. Z
p
(max).
b. Z
G
(max).
c. L
P
(max).
d. L
G
(max).
e. R
P
(max).
f. R
G
(max).
g. f.
h. f
tr
.
i. f
tp
.
j. t
t
.
k. t
Pmin
.