MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第54页

MIL-STD-883F METHOD 1009.8 22 March 1989 6 2. Soli d sidewall pack ages, met al platf orm pac kages, and pin gri d arrays : a. Expose one-half of sampl es wit h lids upward: b. Expose other one-half of samples with l ead…

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MIL-STD-883F
METHOD 1009.8
22 March 1989
5
FIGURE 1009-1a. Dual-in-line packages with leads attached to, or exiting from
package sides (such as side-brazed packages and ceramic dual-
in-line packages):
FIGURE 1009-1b. Packages with leads attached to, or exiting from opposite
sides of lids (such as TO cans, solid sidewall packages,
metal platform packages, and pin grid arrays):
1. TO cans:
a. Expose one-half of samples with caps upward:
b. Expose other one-half of samples with leads upward:
FIGURE 1009-1. Example sample orientations
.
MIL-STD-883F
METHOD 1009.8
22 March 1989
6
2. Solid sidewall packages, metal platform packages, and pin grid arrays:
a. Expose one-half of samples with lids upward:
b. Expose other one-half of samples with leads upward:
FIGURE 1009-1c. Packages with leads attached to, or exiting from
package sides, parallel to lid (such as flatpacks):
NOTE: If the case is metal, one-half of the samples shall be tested with the
lids exposed upward, the other one-half with the cases exposed upward.
FIGURE 1009-1. Example sample orientations
- Continued.
MIL-STD-883F
METHOD 1009.8
22 March 1989
7
FIGURE 1d. Leadless or leaded chip carriers:
1. Expose one-half of samples with lids upward:
2. Expose other one-half of samples with lids downward:
FIGURE 1009-1. Example sample orientations
- Continued.