MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第545页

MIL-STD-883F METHOD 3024 19 August 1994 1 METHOD 3024 SIMULTANEOUS SW ITCHI NG NOISE MEASUREMENTS FOR DIGITAL MICROELECTRONI C DEVICES 1. Purpose . This method est ablis hes the pr ocedure f or measur ing the gr ound bou…

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MIL-STD-883F
METHOD 3023
5 November 1999
2
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MIL-STD-883F
METHOD 3024
19 August 1994
1
METHOD 3024
SIMULTANEOUS SWITCHING NOISE MEASUREMENTS
FOR DIGITAL MICROELECTRONIC DEVICES
1. Purpose
. This method establishes the procedure for measuring the ground bounce (and V
CC
bounce) noise in digital
microelectronic devices or to determine compliance with specified ground bounce noise requirements in the applicable
acquisition document. It is also intended to provide assurance of interchangeability of devices and to eliminate
misunderstanding between manufacturers and users on ground bounce noise test procedures and requirements. This
procedure is not intended to predict the amount of noise generated on an end product board, but for use in measuring
ground bounce noise using a standardized method for comparing noise levels between logic families and vendors.
1.1 Definitions
. The following definitions shall apply for the purposes of this test method:
a. Ground bounce noise. The voltage amplitude (peak) of extraneous signals present on a low-level non-switching
output with a specified number of other outputs switching. Ground bounce noise on a logic low output can be of
sufficient amplitude to exceed the high level threshold of a receiver, or cause latch-up on unprotected CMOS
inputs.
b. V
CC
bounce noise. The voltage amplitude (peak) of extraneous signals present on a high-level non-switching
output with a specified number of other outputs switching. V
CC
bounce on a logic high output can be of sufficient
amplitude to exceed the low level threshold of a receiver, or cause latch-up on unprotected CMOS inputs.
c. Simultaneous switching noise. Noise generated across the inductance of a package pin as a result of the charge
and discharge of load capacitance through two or more transitioning output pins.
d. Quiet low. A non-switching output which is driving a nominal low level.
e. Quiet high. AQ non-switching output which is driving a nominal high level.
f. Signal skew. The amount of time measured between any two signal transitions at the 1.5 V voltage level (for TTL
threshold devices) and at V
CC
/2 (for CMOS threshold devices).
1.2 Symbols
. The following symbols shall apply for the purposes of this test method:
1.2.1 Logic levels
.
V
IL
max: The maximum allowed input low level on a digital microelectronic device.
V
IL
min: The minimum allowed input low level on a digital microelectronic device.
V
IH
max: The maximum allowed input high level on a digital microelectronic device.
V
IH
min: The minimum allowed input high level on a digital microelectronic device.
MIL-STD-883F
METHOD 3024
19 August 1994
2
1.2.2 Noise levels.
V
OLP
max: The largest positive amplitude transient allowed on a logic low output.
V
OLV
max: The largest negative amplitude transient allowed on a logic low output.
V
OHP
max: The largest positive amplitude transient allowed on a logic high output.
V
OHV
max: The largest negative amplitude transient allowed on a logic high output.
1.2.3 Transition times
.
T
TLH
: The transition time of a rising edge (rise time) measured from 10 percent to 90 percent.
T
THL
: The transition time of a rising edge (fall time) measured from 90 percent to 10 percent.
2. Apparatus
. The apparatus used for ground bounce noise measurements shall include a suitable source generator (see
2.1), loads (see 2.2), an oscilloscope (see 2.3) and a low noise test fixture (see 2.4). See figure 3024-1 for proper
connections.
2.1 Source generator
. The pulse or pattern generator for this test shall be capable of supplying the required input pulses
with transition times of 3.0
±0.5 ns to minimize skew due to input threshold differences.
2.2 Loads
. Loads shall consist of 50 pF capacitance (-0,+20%) and a 500 ohm (±1%) low inductance resistor from each
output to ground. Capacitance value should include probe and test fixture capacitance. The 500 ohm resistor may be made
up of a 450 ohm resistor in series with a 50 ohm oscilloscope input channel or 50 ohm termination.
2.3 Oscilloscope
. The oscilloscope and probe combination shall have a minimum bandwidth of 1 GHz. Probes (if used)
must be calibrated using the manufacturers instructions before accurate measurements can be made.
2.4 Test fixture
. Test fixture construction has a large impact on the accuracy of the results. Therefore, the standard ESH
test fixture or an equivalent approved fixture (one which demonstrates results within 10% of the standard) must be used to
perform these tests. (The ESH fixture for DIP devices is LAB-350-28. Other standard fixtures will be determined at a later
date.) Lead lengths should be 0.25 inches or less. The devices under test may be clamped to the test fixture, soldered to
the fixture, or installed in a socket on the fixture. Use of a socket may result in higher readings.
3. Procedure
. The device shall be installed on the low noise fixture. All outputs of the device under test shall be loaded
as specified in 2.2. All outputs (as many as functionally possible) shall be conditioned to switch using the setup information
in 3.1. Tests shall be performed using the procedures in 3.2.
3.1 Setup parameters
.
3.1.1 Supply voltage
. Power supply voltage shall be at nominal operating voltage (5.0 volts for most families).
3.1.2 Test temperature
. All tests shall be performed at 25°C.
3.1.3 Input conditioning
. Input voltage levels shall be 0.0 V low level and V
CC
for CMOS and 3.0 V for TTL for high level
for both static and switching inputs. Switching inputs shall be driven by 1 MHz signals with 2.0
±0.5 ns transition times.
Maximum skew (made at the device package inputs) between any two input signals (including out-of-phase signals) shall be
less than 1 ns. See figure 3024-2.