MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第55页
MIL-STD-883F METHOD 1009.8 22 March 1989 7 FIGURE 1d. Leadl ess or leaded chi p carr iers : 1. Expose one-half of sampl es wit h lids upward: 2. Expose other one- half of samples with l ids downwar d: FIGURE 1009-1. Exam…
MIL-STD-883F
METHOD 1009.8
22 March 1989
6
2. Solid sidewall packages, metal platform packages, and pin grid arrays:
a. Expose one-half of samples with lids upward:
b. Expose other one-half of samples with leads upward:
FIGURE 1009-1c. Packages with leads attached to, or exiting from
package sides, parallel to lid (such as flatpacks):
NOTE: If the case is metal, one-half of the samples shall be tested with the
lids exposed upward, the other one-half with the cases exposed upward.
FIGURE 1009-1. Example sample orientations
- Continued.
MIL-STD-883F
METHOD 1009.8
22 March 1989
7
FIGURE 1d. Leadless or leaded chip carriers:
1. Expose one-half of samples with lids upward:
2. Expose other one-half of samples with lids downward:
FIGURE 1009-1. Example sample orientations
- Continued.
MIL-STD-883F
METHOD 1009.8
22 March 1989
8
FIGURE 1009.2. Corrosion area charts
.