MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS - 第582页

MIL-STD-883F METHOD 5002.1 15 August 1984 2 This page i ntenti onally lef t blank

MIL-STD-883F

METHOD 5002.1

15 August 1984

METHOD 5002.1

PARAMETER DISTRIBUTION CONTROL

1. PURPOSE

. The purpose of this method is to define a technique for assuring a normal distribution for any test method

listed in the 3000 or 4000 series of this standard. This method is not intended for general application to acquisitions where it

is important only to assure that device parameters are between specified limits. It is intended for use only where it is

necessary to control the distribution of parameter values within the specified group. When this method is employed, it is

expected that the specified group of devices tested will be packaged for shipment as a group together with the required data.

It is also expected that some provisions will be required for special marking of devices subjected to this method to identify

that they have met the selection criteria involved and that they are therefore not directly interchangeable with identical

devices which have not been controlled or selected in this manner.

2. APPARATUS

. For distribution control, it is desirable for the measuring equipment, in addition to the capabilities listed

in section 3000 and 4000, to have the capability of rejecting and counting the devices above or below the specified extreme

limits, and to also separate and count the devices that fall above or below the sigma limits. If the equipment does not have

this capability, the units shall be read to the specified parameter conditions and the data recorded. Identification of units to

the data shall also be required. Data analysis and unit separation shall be hand performed in the case where automatic

equipment is not used.

3. PROCEDURE

. Microelectronic devices shall be separated into groups. Each group will be tested, in accordance with

the specific method for the maximum and minimum limits specified in the applicable acquisition document. All failures will

be removed from the original group. The remaining units will be tested for the following: Not less than 12 percent but not

greater than 18 percent of units tested will fall below the mean -1σ limit. Not greater than 18 percent but not less than 12

percent of units tested will fall above the mean +1σ limit.

4. SUMMARY

. The following details must be specified in the applicable acquisition document:

a. Absolute maximum and minimum limits.

b. Mean value.

c. +1σ and -1σ value.

d. Group size.

e. Requirements for data logging, special markings, and special provisions for packaging and shipment, where

applicable.

MIL-STD-883F

METHOD 5002.1

15 August 1984

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MIL-STD-883F

METHOD 5003

20 November 1969

METHOD 5003

FAILURE ANALYSIS PROCEDURES FOR MICROCIRCUITS

1. PURPOSE

. Failure analysis is a post mortem examination of failed devices employing, as required, electrical

measurements and many of the advanced analytical techniques of physics, metallurgy, and chemistry in order to verify the

reported failure and identify the mode or mechanism of failure as applicable. The failure analysis procedure (as indicated by

test condition letter) shall be sufficient to yield adequate conclusions, for determination of cause or relevancy of failure or for

initiation of corrective action in production processing, device design, test or application to eliminate the cause or prevent

recurrence of the failure mode or mechanism reported.

1.1 Data requirements

. When required by the applicable acquisition document the failure analyst shall receive, with the

failed part, the following information:

a. Test conditions: This shall include the type of test or application, the in-service time (when available), temperature,

and other stress conditions under which the device failed.

b. System conditions: This shall include the exact location of failure in the equipment, date, test and inspection or

both, at which defect was first noted, any unusual environmental conditions and all related system anomalies noted

at time of removal of the failed unit. The equipment symptoms shall also be recorded.

c. General device information: This shall include part type numbers and serial numbers (when applicable), date

code, and other identifying information, and size of production or inspection lot (when applicable).

2. APPARATUS

. The apparatus required for failure analysis includes electrical test equipment capable of complete

electrical characterization of the device types being analyzed, micromanipulators capable of point-to-point probing on the

surface of device dies or substrates, as required, and microscopes capable of making the observations at the magnifications

indicated in the detailed procedures for the specified test condition. In addition, special analytical equipment for bright field,

dark field and phase contrast microscopy, metallographic sectioning, and angle lapping are required for the test condition C.

Special analytical equipment for test condition D are as detailed in the procedure and shall be available only as required for

each specific device analysis at that level. Apparatus for x-ray radiography, hermeticity test, and other specific test methods

shall be as detailed in the referenced method. Cleaning agents, chemicals for etching, staining, oxide, or metallization

removal shall be available as required.

3. PROCEDURE

. Failure analysis shall be performed in accordance with the specified test condition letter (see 4).

3.1. Test condition A. Failure verification

. This represents a minimal diagnosis, comprised of the electrical verification of

the failure including external and internal photographic recording of the suspected mode or mechanism of failure. The

following steps (see 3.1.1 through 3.1.5) shall be performed in the sequence indicated and the results included in the failure

analysis report. The sequence may be modified or additional tests performed when justified by an analysis of the results of

previous steps in the sequence.

3.1.1 External examination

. This shall include an optical examination at a magnification of 30X minimum of:

a. The condition of the leads, plating, soldered, or welded regions.

b. Condition of external package material, seals, marking, and other failures as warranted.

Photographic records shall be made at suitable magnification of any unusual features.